化学镀Ni-P和Ni-P- si3n4复合镀层的制备与表征

IF 1.2 4区材料科学 Q4 ELECTROCHEMISTRY

Transactions of The Institute of Metal Finishing Pub Date : 1999-01-01 DOI:10.1080/00202967.1999.11871253

J. Balaraju, S. Seshadri

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引用次数: 26

摘要

本工作是化学镀Ni-P和Ni-P- si3n4复合镀层的研究。该镀层由专有的高磷化学镀镍液获得，该镀液由硫酸镍、次亚磷酸钠、络合剂和稳定剂组成。当液中氮化硅的浓度为10 g/l时，化学镀层中氮化硅的重量百分比最大。采用光学显微镜、XRD和TEM对Si3N4含量分别为0、2、5和10 g/l的镀液中Si3N4含量分别为0%、2.01%、5.81%和8.10%的化学镀Ni-P进行了表征。在研究的所有热处理温度下，硬度都随着氮化硅的加入而增加。硬度随氮化硅含量的增加而增加。通过XRD和TEM对复合镀层的分析表明，Si3N4颗粒的加入并没有改变Ni-P基体的非晶态性质。

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Preparation and Characterization of Electroless Ni-P and Ni-P-Si3N4 Composite Coatings

SUMMARYThe present work pertains to the study of electroless Ni-P and Ni-P-Si3N4 composite coatings. The deposits are obtained from a proprietary high phosphorus electroless nickel plating bath, comprising nickel sulphate, sodium hypophosphite, complexing agents and stabilizers. The maximum weight percent of Si3N4 incorporated in the electroless deposit is obtained at a concentration of 10 g/l in the bath. The electroless Ni-P deposits having 0%, 2.01%, 5.81% and 8.10% of Si3N4, respectively, obtained from baths containing 0, 2, 5 and 10 g/l of Si3N4, are characterized by optical microscopy, XRD and TEM. Hardness is found to increase with the incorporation of Si3N4 at all heat treatment temperatures studied. Also hardness increases with an increase in weight percent of Si3N4 incorporated in the deposit. The analyses of the composite coatings by XRD and TEM reveal that the inclusion of Si3N4 particles does not change the amorphous nature of the Ni-P matrix.

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来源期刊

Transactions of The Institute of Metal Finishing 工程技术-材料科学：膜

CiteScore

3.40

自引率

10.50%

发文量

审稿时长

3 months

期刊介绍： Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.