化学镀镍制备各向异性导电细颗粒

IF 1.2 4区材料科学 Q4 ELECTROCHEMISTRY

Transactions of The Institute of Metal Finishing Pub Date : 1999-01-01 DOI:10.1080/00202967.1999.11871242

I. Motizuki, K. Izawa, Jyoji Watanabe, H. Honma

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引用次数: 6

摘要

SUMMA RY -机械无焊芯片封装与小金块1已增加在电子设备。目前研究了化学镀镍制备导电颗粒(直径5 ~ 7 μm)的方法。一般来说，批量化学镀是为了在非导体上提供导电性。由于粒子s的表面积比基体大得多，因此化学镀液变得不稳定。因此，在制备导电颗粒时，采用连续滴镀法，以乙酸铵为络合剂，使沉积的镍均匀覆盖在颗粒上，在颗粒进入镀液前用表面活性剂处理，在颗粒不凝固的情况下，进一步提高了表面覆盖度。

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Preparation of anisotropic conductive fine particles by electroless nickel plating

SUMMA RY - Mechanical solderless chip packaging with small gold bumps 1 has increased in electronic devices. The preparation of conductive particles (5 ∼ 7 μm diameter ) by electroless nickel plating has now been investigated. Generally, batch type electroless plating is applied to provide conductivity on nonconductors. Since the surface areas of particle s are much larger than the bulk substrate, accordingly the electroless plating bath becomes unstable. The continuous dropping method has therefore been applied, in the preparation of conductive particles Uniform coverage of deposited nickel on the particles was obtained by using ammonium acetate as a complexing agent, and surface coverage was further improved without coagulation of particles by treatment with a surface active agent before their introduction to the plating bath.

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来源期刊

Transactions of The Institute of Metal Finishing 工程技术-材料科学：膜

CiteScore

3.40

自引率

10.50%

发文量

审稿时长

3 months

期刊介绍： Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.