电沉积Ni-B合金膜中硼共沉积机理及共沉积硼量的计算

IF 1.2 4区材料科学 Q4 ELECTROCHEMISTRY

Transactions of The Institute of Metal Finishing Pub Date : 1999-01-01 DOI:10.1080/00202967.1999.11871243

M. Onoda, K. Shimizu, Yukio Tateishi, Tohru Watanabe

{"title":"电沉积Ni-B合金膜中硼共沉积机理及共沉积硼量的计算","authors":"M. Onoda, K. Shimizu, Yukio Tateishi, Tohru Watanabe","doi":"10.1080/00202967.1999.11871243","DOIUrl":null,"url":null,"abstract":"SUMMARYWe electrodeposited Ni-B ahoy films using a rotary electrode under various plating conditions and investigated the mechanism of the codeposition of B into the plated films by analyzing the relationship between the electrodeposition conditions and the composition of the plated films, as well as by analyzing electrochemical measurements. We reached the following conclusions: 1) In Ni-B alloy plating by electrodeposition, use of a rotary electrode expands the useful current density regions compared to a static bath.2) Unionized TMAB is present in the plating solution, and the deposition rate of B is related to the thickness of the diffusion layer at the cathode surface, regardless of the electrode potential. Accordingly, the amount of codedeposited B can he calculated from v0.7 and l/I, i.e., peripheral speed and current density.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.2000,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871243","citationCount":"8","resultStr":"{\"title\":\"Mechanism of Boron Codeposition in Electrodeposited Ni-B Alloy Films and Calculation of the Amount of Codeposited Boron\",\"authors\":\"M. Onoda, K. Shimizu, Yukio Tateishi, Tohru Watanabe\",\"doi\":\"10.1080/00202967.1999.11871243\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"SUMMARYWe electrodeposited Ni-B ahoy films using a rotary electrode under various plating conditions and investigated the mechanism of the codeposition of B into the plated films by analyzing the relationship between the electrodeposition conditions and the composition of the plated films, as well as by analyzing electrochemical measurements. We reached the following conclusions: 1) In Ni-B alloy plating by electrodeposition, use of a rotary electrode expands the useful current density regions compared to a static bath.2) Unionized TMAB is present in the plating solution, and the deposition rate of B is related to the thickness of the diffusion layer at the cathode surface, regardless of the electrode potential. Accordingly, the amount of codedeposited B can he calculated from v0.7 and l/I, i.e., peripheral speed and current density.\",\"PeriodicalId\":23268,\"journal\":{\"name\":\"Transactions of The Institute of Metal Finishing\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":1.2000,\"publicationDate\":\"1999-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1080/00202967.1999.11871243\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Transactions of The Institute of Metal Finishing\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1080/00202967.1999.11871243\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ELECTROCHEMISTRY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Transactions of The Institute of Metal Finishing","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1080/00202967.1999.11871243","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ELECTROCHEMISTRY","Score":null,"Total":0}

引用次数: 8

摘要

摘要:利用旋转电极在不同的电镀条件下电沉积了Ni-B - ahoy薄膜，通过分析电沉积条件与镀层成分的关系以及电化学测量结果的分析，探讨了B在镀层中共沉积的机理。得到以下结论:1)电沉积镀Ni-B合金时，旋转电极的使用比静态电极扩大了有效电流密度区域。2)镀液中存在游离化的TMAB, B的沉积速率与阴极表面扩散层的厚度有关，而与电极电位无关。因此，可以从v0.7和l/I(即外设速度和电流密度)计算出编码沉积的B量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Mechanism of Boron Codeposition in Electrodeposited Ni-B Alloy Films and Calculation of the Amount of Codeposited Boron

SUMMARYWe electrodeposited Ni-B ahoy films using a rotary electrode under various plating conditions and investigated the mechanism of the codeposition of B into the plated films by analyzing the relationship between the electrodeposition conditions and the composition of the plated films, as well as by analyzing electrochemical measurements. We reached the following conclusions: 1) In Ni-B alloy plating by electrodeposition, use of a rotary electrode expands the useful current density regions compared to a static bath.2) Unionized TMAB is present in the plating solution, and the deposition rate of B is related to the thickness of the diffusion layer at the cathode surface, regardless of the electrode potential. Accordingly, the amount of codedeposited B can he calculated from v0.7 and l/I, i.e., peripheral speed and current density.

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来源期刊

Transactions of The Institute of Metal Finishing 工程技术-材料科学：膜

CiteScore

3.40

自引率

10.50%

发文量

审稿时长

3 months

期刊介绍： Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.