衬底表面条件对控制化学镀镍层孔隙率的重要性

IF 1.2 4区 材料科学 Q4 ELECTROCHEMISTRY
G. W. Reade, C. Kerr, B. D. Barker, F. Walsh
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引用次数: 18

摘要

概述了影响EN沉积物孔隙度的因素,并考虑了三个方面:(a)含铁材料的类型(例如“芘”钢板,机加工钢,铸铁),(b)表面粗糙度的性质和程度(例如由磨料纸,喷砂或化学清洗产生)以及(c)应用于钢的化学预处理类型。一系列不同的衬底类型(喷砂、研磨、铣削和冷轧)已被化学镀镍到三种不同的厚度,并测试了孔隙率。研究了预处理类型的性质及其对镀层孔隙度的影响。Talysurf测量表明,当沉积厚度达到24 μm时,表面形貌没有明显变化。从显微、剖面、电化学和腐蚀速率测量中获得的数据被用来说明这些因素在控制EN沉积物孔隙度和腐蚀速率方面的重要性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The Importance of Substrate Surface Condition in Controlling the Porosity of Electroless Nickel Deposits
SummaryAn overview is presented of factors affecting the porosity of EN deposits and considers three aspects: (a) the type of ferrous material (e.g. ‘Pyrene’ steel panels, machined steel, cast iron), (b) the nature and degree of surface roughness (produced e.g. by abrasive papers, grit blasting or chemical cleaning) and (c) the type of chemical pretreatment applied to the steel. A range of different substrate types (grit blasted, ground, milled and cold rolled) have been electroless nickel plated to three different thicknesses and tested for porosity. The nature of the type of pretreatment and its effect on deposit porosity has also been investigated. Talysurf measurements have shown that the surface morphology does not change significantly with deposit thicknesses up to 24 μm.Data obtained from microscopy, profilometric, electrochemical and corrosion rate measurements are used to illustrate the importance of these factors in controlling the degree of porosity in the EN deposit and the rate of corrosion o...
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来源期刊
Transactions of The Institute of Metal Finishing
Transactions of The Institute of Metal Finishing 工程技术-材料科学:膜
CiteScore
3.40
自引率
10.50%
发文量
62
审稿时长
3 months
期刊介绍: Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.
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