{"title":"高速率氧化硅涂层的微波等离子体增强CVD","authors":"O. Takai, T. Honjo","doi":"10.1080/00202967.1998.11871184","DOIUrl":null,"url":null,"abstract":"SummaryMicrowave plasma-enhanced CVD has been studied for the high rate coatings of silicon oxide using methyltrimethoxysilane, an organosilicon compound, and oxygen as gas sources. The transparent hard films could be deposited onto substrates at the high rate of about 1 μm/min. The composition of the films prepared at pressures below 100 Pa was similar to silicon dioxide. Analyses of the films were carried out by using XRD, FT-IR, XPS and AES.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":"76 1","pages":"16-18"},"PeriodicalIF":1.2000,"publicationDate":"1998-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1998.11871184","citationCount":"0","resultStr":"{\"title\":\"Microwave Plasma-Enhanced CVD for High Rate Coatings of Silicon Oxide\",\"authors\":\"O. Takai, T. Honjo\",\"doi\":\"10.1080/00202967.1998.11871184\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"SummaryMicrowave plasma-enhanced CVD has been studied for the high rate coatings of silicon oxide using methyltrimethoxysilane, an organosilicon compound, and oxygen as gas sources. The transparent hard films could be deposited onto substrates at the high rate of about 1 μm/min. The composition of the films prepared at pressures below 100 Pa was similar to silicon dioxide. Analyses of the films were carried out by using XRD, FT-IR, XPS and AES.\",\"PeriodicalId\":23268,\"journal\":{\"name\":\"Transactions of The Institute of Metal Finishing\",\"volume\":\"76 1\",\"pages\":\"16-18\"},\"PeriodicalIF\":1.2000,\"publicationDate\":\"1998-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1080/00202967.1998.11871184\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Transactions of The Institute of Metal Finishing\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1080/00202967.1998.11871184\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ELECTROCHEMISTRY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Transactions of The Institute of Metal Finishing","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1080/00202967.1998.11871184","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ELECTROCHEMISTRY","Score":null,"Total":0}
Microwave Plasma-Enhanced CVD for High Rate Coatings of Silicon Oxide
SummaryMicrowave plasma-enhanced CVD has been studied for the high rate coatings of silicon oxide using methyltrimethoxysilane, an organosilicon compound, and oxygen as gas sources. The transparent hard films could be deposited onto substrates at the high rate of about 1 μm/min. The composition of the films prepared at pressures below 100 Pa was similar to silicon dioxide. Analyses of the films were carried out by using XRD, FT-IR, XPS and AES.
期刊介绍:
Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.