肼在钨膜上的非均相分解

R. C. Cosser, F. Tompkins
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引用次数: 18

摘要

在等温条件下,研究了195 K时吸附在钨膜上的肼在195 ~ 455k的分解过程,以及分解温度随时间线性升高时的分解过程。分解发生在两个主要过程中:(i)解离化学吸附形成吸附的酰胺自由基,然后进一步表面解离,从而产生吸附的亚胺自由基(甚至氮附着原子)和可移动的氢附着原子;后者结合并随后解吸成为氢分子;(ii)联氨分子与表面钨原子的结合化学吸附;这样形成的活化表面络合物分解产生氨和氮,主要是通过反应:3N2H4→4NH3+ N2。钨薄膜分解的研究(一)被先前的分解产物污染(ii)氢饱和;(iii)一氧化碳或氨的预吸附和后吸附均部分饱和,表明分子吸附发生在(110)平面上,其他平面对解离吸附有活性。在所述(110)平面上,联氨分子似乎与单个钨原子相连;在其他平面上,它占据了四个相邻的表面站点。这一双重机制与先前关于联氨在多种不同表面上的非均相分解的结果一致。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Heterogeneous decomposition of hydrazine on tungsten films
The decomposition, in the temperature range 195–455 K, of hydrazine chemisorbed on tungsten films at 195 K has been studied under isothermal conditions, and also when the temperature of decomposition was increased linearly with time. Decomposition occurs by two main processes: (i) by dissociative chemisorption to form adsorbed amide radicals, followed by further surface dissociation, thereby producing adsorbed imide radicals (or even nitrogen adatoms) and mobile hydrogen adatoms; these latter combine and subsequently desorb as hydrogen molecules; (ii) by associative chemisorption of the hydrazine molecule to surface tungsten atoms; the activated surface complex so formed breaks down to give ammonia and nitrogen, largely by the reaction: 3N2H4→ 4NH3+ N2. A study of the decomposition on tungsten films (i) contaminated by the products of a previous decomposition; (ii) presaturated with hydrogen; (iii) partially saturated by both presorption and postsorption of either carbon monoxide or ammonia, indicated that the molecular adsorption takes place on the (110) plane and that the other planes are active for the dissociative adsorption. On the (110) plane, the hydrazine molecule appears to be attached to a single tungsten atom; on the other planes, it occupies four adjacent surface sites. This dual mechanism is consistent with previous results on the heterogeneous decomposition of hydrazine on a wide variety of different surfaces.
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