IEEE 802.11 a WPA多节点实验室链路扩展性能研究

IF 0.4 4区 工程技术 Q4 ENGINEERING, MULTIDISCIPLINARY
J. P. Carvalho, H. Veiga, C. Pacheco, A. Reis
{"title":"IEEE 802.11 a WPA多节点实验室链路扩展性能研究","authors":"J. P. Carvalho, H. Veiga, C. Pacheco, A. Reis","doi":"10.1007/978-981-15-8273-8_14","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":11585,"journal":{"name":"Engineering Letters","volume":null,"pages":null},"PeriodicalIF":0.4000,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Extended Performance Research on IEEE 802.11 a WPA Multi-node Laboratory Links\",\"authors\":\"J. P. Carvalho, H. Veiga, C. Pacheco, A. Reis\",\"doi\":\"10.1007/978-981-15-8273-8_14\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":11585,\"journal\":{\"name\":\"Engineering Letters\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.4000,\"publicationDate\":\"2020-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Engineering Letters\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1007/978-981-15-8273-8_14\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Engineering Letters","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1007/978-981-15-8273-8_14","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 4

摘要

本文章由计算机程序翻译,如有差异,请以英文原文为准。
Extended Performance Research on IEEE 802.11 a WPA Multi-node Laboratory Links
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来源期刊
Engineering Letters
Engineering Letters ENGINEERING, MULTIDISCIPLINARY-
CiteScore
2.20
自引率
33.30%
发文量
0
期刊介绍: Engineering Letters is published with both online and print versions. The journal covers the frontier issues in the engineering and the computer science and their applications in business, industry and other subjects. The computer science is a branch of engineering science that studies computable processes and structures. It contains theories for understanding computing systems and methods; computational algorithms and tools; methodologies for testing of concepts. The subjects covered by the journal include artificial intelligence, bioinformatics, computational statistics, database, data mining, electronics, financial engineering, hardware systems, imaging engineering, industrial engineering, information engineering, internet computing, networking, operations research, scientific computing, software engineering, telecommunications, and their applications etc.
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