纳米划痕诱导树脂掩膜金属微/纳米结构的形成

IF 4.703 3区 材料科学
Mingyong Xin, Qihui Feng, Changbao Xu, Licong Cui, Jie Zhu, Yinkai Gan, Bingjun Yu
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引用次数: 0

摘要

金属微纳米结构具有体积小、性能优越等优点,具有广泛的应用前景。为了获得高性能的器件,开发高质量、低成本和精确定位的金属微纳米结构的新方法具有重要的意义。发现金属在硅表面的定向沉积可以获得金属微纳结构,其中掩膜在这一过程中起着关键作用。本文主要研究了酮醛树脂掩膜的制备及其对划痕诱导金(Au)微纳米结构形成的影响。同时发现具有一定厚度的酮醛树脂可以作为高质量的金沉积的满意掩膜,并且在较低的正常载荷和较少的划痕周期下产生的划痕更有利于致密金结构的形成。根据所提出的方法,可以在设计的划痕上制备二维Au结构,为制作高质量的金属基传感器提供了可行的途径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Nanoscratch-induced formation of metallic micro/nanostructures with resin masks

Metallic micro/nanostructures present a wide range of applications due to the small size and superior performances. In order to obtain high-performance devices, it is of great importance to develop new methods for preparing metallic micro/nanostructures with high quality, low cost, and precise position. It is found that metallic micro/nanostructures can be obtained by scratch-induced directional deposition of metals on silicon surface, where the mask plays a key role in the process. This study is focused on the preparation of keto-aldehyde resin masks and their effects on the formation of scratch-induced gold (Au) micro/nanostructures. It is also found that the keto-aldehyde resin with a certain thickness can act as a satisfactory mask for high-quality Au deposition, and the scratches produced under lower normal load and less scratching cycles are more conducive to the formation of compact Au structures. According to the proposed method, two-dimensional Au structures can be prepared on the designed scratching traces, providing a feasible path for fabricating high-quality metal-based sensors.

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来源期刊
Nanoscale Research Letters
Nanoscale Research Letters NANOSCIENCE & NANOTECHNOLOGY-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
15.00
自引率
0.00%
发文量
110
审稿时长
2.5 months
期刊介绍: Nanoscale Research Letters (NRL) provides an interdisciplinary forum for communication of scientific and technological advances in the creation and use of objects at the nanometer scale. NRL is the first nanotechnology journal from a major publisher to be published with Open Access.
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