有机硅改性环氧树脂基复合材料的树电阻性能

IF 1.4 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Yongqiang Wang, Tianyu Ma, Fengxiao Zhang, Jing Shang
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引用次数: 0

摘要

为了提高环氧树脂的抗树枝状电阻,采用二羟基二苯基硅烷和新型有机硅改性剂改性环氧树脂和微米二氧化硅制备了复合材料,并对复合材料进行了加速热老化试验和电树试验,记录了电树的生长过程,进一步获得了实验样品中电树的特征参数。结果表明,有机硅改性环氧树脂/二氧化硅复合材料具有比未改性的环氧树脂/硅胶复合材料和纯环氧树脂更好的热稳定性和抗树枝状电阻。扫描电子显微镜(SEM)和击穿场强结果分析表明,改性剂的引入增强了环氧树脂与二氧化硅之间的界面性能。在电树测试结束时,硅改性环氧树脂/二氧化硅复合材料中的电树长度至少为相同二氧化硅填充比的未改性环氧树/二氧化硅复合物中电树长度的25.31%,为纯环氧树脂中电树的9.19%,而与未添加二氧化硅的树脂相比,有机硅改性环氧树脂/二氧化硅复合材料中的电树具有较低的膨胀因子和较高的分形维数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Properties of electrical tree resistance of silicone-modified epoxy resin matrix composites

Properties of electrical tree resistance of silicone-modified epoxy resin matrix composites

In order to improve the electrical tree resistance of epoxy resin, composites were prepared using dihydroxydiphenylsilane and a novel silicone modifier modified epoxy resin and micron silica, and the composites were subjected to accelerated thermal aging test and electrical tree test and recorded the growth process of electrical trees to further obtain the characteristic parameters of electrical trees in the experimental samples. The results show that the silicone-modified epoxy resin/silica composite has better thermal stability and electrical tree resistance than the unmodified epoxy resin/silica composite and pure epoxy resin. Analysis of the scanning electron microscope (SEM) and breakdown field strength results show that the introduction of the modifier enhanced interfacial properties between the epoxy resin and silica. At the end of the electrical tree test, the length of the electrical tree in the silicone-modified epoxy resin/silica composite was at a minimum 25.31% of the length of the electrical tree in the unmodified epoxy resin/silica composite with the same silica filling ratio, and 9.19% of the length of the electrical tree in the pure epoxy, while the electrical trees in the silicone-modified epoxy resin/silica composite have lower expansion factors, as well as higher fractal dimensions, compared to those in the resin without added silica.

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来源期刊
Iet Science Measurement & Technology
Iet Science Measurement & Technology 工程技术-工程:电子与电气
CiteScore
4.30
自引率
7.10%
发文量
41
审稿时长
7.5 months
期刊介绍: IET Science, Measurement & Technology publishes papers in science, engineering and technology underpinning electronic and electrical engineering, nanotechnology and medical instrumentation.The emphasis of the journal is on theory, simulation methodologies and measurement techniques. The major themes of the journal are: - electromagnetism including electromagnetic theory, computational electromagnetics and EMC - properties and applications of dielectric, magnetic, magneto-optic, piezoelectric materials down to the nanometre scale - measurement and instrumentation including sensors, actuators, medical instrumentation, fundamentals of measurement including measurement standards, uncertainty, dissemination and calibration Applications are welcome for illustrative purposes but the novelty and originality should focus on the proposed new methods.
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