基于SVR的机器学习算法在晶圆级封装焊点可靠性生命周期预测中的应用

IF 1.5 4区 工程技术 Q3 MECHANICS
H. Kuo, C. Y. Chang, Cadmus C A Yuan, K. Chiang
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引用次数: 0

摘要

新的电子封装结构的开发通常涉及模拟设计(DoS)方法。然而,模拟结果可能是主观的,结果可能会有差异,这取决于谁在进行模拟。为了解决这个问题,包装设计师现在转向机器学习,以提高设计过程的准确性和效率。本研究的重点是使用支持向量回归(SVR)技术,如单核、多核和一种新的支持向量回归技术,来预测晶圆级封装(WLP)的可靠性。通过这样做,该研究旨在为设计师提供一种可靠的方法来评估其包装设计的可靠性生命周期。该研究包括三个步骤:使用有限元分析和实验结果验证WLP的可靠性,验证的有限元分析结果将作为输入,通过SVR技术获得预测模型,并评估预测模型的性能。结果表明,使用SVR技术开发的预测模型在不同的测试数据上具有稳定的性能,与有限元分析结果一致。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Wafer-level packaging solder joint reliability lifecycle prediction using SVR-based machine learning algorithm
The development of new electronic packaging structures often involves a design-on-simulation (DoS) approach. However, simulation results can be subjective, and there can be variances in outcomes depending on who is conducting the simulation. To address this issue, packaging designers are now turning to machine learning to increase the accuracy and efficiency of the design process. This research study focuses on using support vector regression (SVR) techniques, such as single kernel, multiple kernels, and a new support vector regression technique, to predict the reliability of the Wafer-Level Package (WLP). By doing so, the study aims to provide designers with a reliable way to assess the reliability life cycle of their packaging designs. The study involves three steps: validating the WLP's reliability using FEA and experiment results, the validated FEA result will serve as input to obtain a predictive model through the SVR technique, and the predictive model's performance will be evaluated. The results show that the predictive models developed using the SVR technique have stable performance on different testing data, which is consistent with the FEA results.
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来源期刊
Journal of Mechanics
Journal of Mechanics 物理-力学
CiteScore
3.20
自引率
11.80%
发文量
20
审稿时长
6 months
期刊介绍: The objective of the Journal of Mechanics is to provide an international forum to foster exchange of ideas among mechanics communities in different parts of world. The Journal of Mechanics publishes original research in all fields of theoretical and applied mechanics. The Journal especially welcomes papers that are related to recent technological advances. The contributions, which may be analytical, experimental or numerical, should be of significance to the progress of mechanics. Papers which are merely illustrations of established principles and procedures will generally not be accepted. Reports that are of technical interest are published as short articles. Review articles are published only by invitation.
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