半导体制造过程中故障检测的机器学习方法:近期应用和未来展望

IF 1.6 4区 生物学 Q4 BIOTECHNOLOGY & APPLIED MICROBIOLOGY
V. Arpitha, A. Pani
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引用次数: 3

摘要

在现代工业中,早期故障检测对于维护工艺安全和产品质量至关重要。过程数据包含整个工厂的信息,作为各种工厂单元之间关系可视化的地图,使数据驱动的过程监控成为提高效率的关键技术。本文重点综述了半导体制造业中批量操作的金属蚀刻工艺的工艺监控技术。综述了迄今为止应用于金属蚀刻过程故障检测和诊断的各种机器学习(和深度学习)技术。对不同技术的研究工作的详细调查以及报告的结果以图形(饼图和条形图)和表格形式呈现。综述了金属刻蚀技术的优缺点、差距和未来发展方向。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Machine Learning Approaches for Fault Detection in Semiconductor Manufacturing Process: A Critical Review of Recent Applications and Future Perspectives
In modern industries, early fault detection is crucial for maintaining process safety and product quality. Process data contains information on the entire plant acting as a map for visualization of relationships between various plant units, making data-driven process monitoring a key technology for efficiency enhancement. This article focuses on review of process monitoring techniques reported for metal etching process, which is a batch operation carried out in semiconductor manufacturing industry. Various machine learning (and deep learning) techniques applied to date for fault detection and diagnosis of metal etching process are surveyed. Detailed survey of research work on different techniques and the reported results are presented in graphical (pie chart and bar chart) and tabular format. The review article further presents the pros and cons, gaps and future directions in the techniques applied in metal etching process.
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来源期刊
Chemical and Biochemical Engineering Quarterly
Chemical and Biochemical Engineering Quarterly 工程技术-工程:化工
CiteScore
2.70
自引率
6.70%
发文量
23
审稿时长
>12 weeks
期刊介绍: The journal provides an international forum for presentation of original papers, reviews and discussions on the latest developments in chemical and biochemical engineering. The scope of the journal is wide and no limitation except relevance to chemical and biochemical engineering is required. The criteria for the acceptance of papers are originality, quality of work and clarity of style. All papers are subject to reviewing by at least two international experts (blind peer review). The language of the journal is English. Final versions of the manuscripts are subject to metric (SI units and IUPAC recommendations) and English language reviewing. Editor and Editorial board make the final decision about acceptance of a manuscript. Page charges are excluded.
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