无铅焊料合金−Sn-1Cu-1Ni-1Ag焊接BGA电子封装的有限元建模和随机振动分析

Q3 Mathematics

International Journal for Simulation and Multidisciplinary Design Optimization Pub Date : 2019-06-01 DOI:10.1051/SMDO/2019013

S. Jayesh, Jacob Elias

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引用次数: 9

摘要

由于焊点中禁止含铅，许多无铅焊点得以发展。大多数电子设备都受到随机振动的影响。本研究开发了一种基于有限元分析和振动测试的分析方法，以预测Sn-1Cu-1Ni-1Ag焊接电子封装在随机振动下的失效和疲劳寿命。研究中使用了一种特殊设计的具有焊接球栅阵列封装的印刷电路板。在ANSYS中建立了有限元模型，并进行了模态分析。有限元结果通过实验（冲击试验）进行了验证。还进行了随机振动分析。这些结果通过随机振动实验得到了验证。利用有限元结果，预测了角部焊点将首先失效。在随机振动实验中观察到，角部焊点首先失效，产生的最大应力为12.8 MPa。因此，结合其力学性能，Sn-1Cu-1Ni-1Ag是一种很有前途的随机振动无铅焊点合金。

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Finite element modeling and random vibration analysis of BGA electronic package soldered using lead free solder alloy − Sn-1Cu-1Ni-1Ag

As a result of the ban of lead from solder joints, many lead-free solder joints were developed. Most of the electronic equipment is subjected to random vibration. This study develops an analysis methodology based on finite element analysis and vibration tests to predict the failure and fatigue life of the electronic package soldered using Sn-1Cu-1Ni-1Ag under random vibration. A specially designed printed circuit board having ball grid array packages soldered is used in the study. Finite element model is developed in ANSYS and modal analysis was done. The finite element results were validated with experiments (impact test). Random vibration analysis was also done. These results were validated with random vibration experiments. Using the finite element results, it was predicted that the corner solder joints will fail first. It was observed in the random vibration experiment that corner solder joint failed first and the maximum stress generated was 12.8 MPa. Thus, Sn-1Cu-1Ni-1Ag is a promising lead-free solder joint alloy under random vibration combining with its mechanical properties.

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来源期刊

International Journal for Simulation and Multidisciplinary Design Optimization Mathematics-Control and Optimization

CiteScore

2.00

自引率

0.00%

发文量

审稿时长

16 weeks

期刊介绍： The International Journal for Simulation and Multidisciplinary Design Optimization is a peer-reviewed journal covering all aspects related to the simulation and multidisciplinary design optimization. It is devoted to publish original work related to advanced design methodologies, theoretical approaches, contemporary computers and their applications to different fields such as engineering software/hardware developments, science, computing techniques, aerospace, automobile, aeronautic, business, management, manufacturing,... etc. Front-edge research topics related to topology optimization, composite material design, numerical simulation of manufacturing process, advanced optimization algorithms, industrial applications of optimization methods are highly suggested. The scope includes, but is not limited to original research contributions, reviews in the following topics: Parameter identification & Surface Response (all aspects of characterization and modeling of materials and structural behaviors, Artificial Neural Network, Parametric Programming, approximation methods,…etc.) Optimization Strategies (optimization methods that involve heuristic or Mathematics approaches, Control Theory, Linear & Nonlinear Programming, Stochastic Programming, Discrete & Dynamic Programming, Operational Research, Algorithms in Optimization based on nature behaviors,….etc.) Structural Optimization (sizing, shape and topology optimizations with or without external constraints for materials and structures) Dynamic and Vibration (cover modelling and simulation for dynamic and vibration analysis, shape and topology optimizations with or without external constraints for materials and structures) Industrial Applications (Applications Related to Optimization, Modelling for Engineering applications are very welcome. Authors should underline the technological, numerical or integration of the mentioned scopes.).