{"title":"用流体体积法评价两相超疏水微流控装置的热水力特性","authors":"U. Aziz, M. Nadeem, Feng Xin, M. Kiliç, A. Ullah","doi":"10.1080/15567265.2022.2070562","DOIUrl":null,"url":null,"abstract":"ABSTRACT The slug flow in a superhydrophobic microchannel with a T-junction was studied computationally. The continuous phase passed through the main channel while the dispersed phase 1 1. was introduced through the side channel. The volume of fluid (VOF) was employed to track the interface to study the dynamics of slug flow. First, a mesh independence study was carried out to select the optimum mesh by comparison of CFD results with experimental data. The developed model of microchannel was used to study slug flow heat transfer enhancement for micro cooling of electronic chips. The constant heat flux was applied on the walls of the microchannels and the axial wall temperature profile was noted. Upon quantification of heat transfer augmentation in terms of wall temperature reduction, Nusselt number and heat transfer coefficient enhancement, it was noted that slug flow performed much better vis-à-vis single-phase flows at similar conditions.","PeriodicalId":49784,"journal":{"name":"Nanoscale and Microscale Thermophysical Engineering","volume":"26 1","pages":"67 - 82"},"PeriodicalIF":2.7000,"publicationDate":"2022-01-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Evaluation of Thermal Hydraulic Characteristics of a Two Phase Superhydrophobic Microfluidic Device using Volume of Fluid Method\",\"authors\":\"U. Aziz, M. Nadeem, Feng Xin, M. Kiliç, A. Ullah\",\"doi\":\"10.1080/15567265.2022.2070562\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"ABSTRACT The slug flow in a superhydrophobic microchannel with a T-junction was studied computationally. The continuous phase passed through the main channel while the dispersed phase 1 1. was introduced through the side channel. The volume of fluid (VOF) was employed to track the interface to study the dynamics of slug flow. First, a mesh independence study was carried out to select the optimum mesh by comparison of CFD results with experimental data. The developed model of microchannel was used to study slug flow heat transfer enhancement for micro cooling of electronic chips. The constant heat flux was applied on the walls of the microchannels and the axial wall temperature profile was noted. Upon quantification of heat transfer augmentation in terms of wall temperature reduction, Nusselt number and heat transfer coefficient enhancement, it was noted that slug flow performed much better vis-à-vis single-phase flows at similar conditions.\",\"PeriodicalId\":49784,\"journal\":{\"name\":\"Nanoscale and Microscale Thermophysical Engineering\",\"volume\":\"26 1\",\"pages\":\"67 - 82\"},\"PeriodicalIF\":2.7000,\"publicationDate\":\"2022-01-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Nanoscale and Microscale Thermophysical Engineering\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1080/15567265.2022.2070562\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nanoscale and Microscale Thermophysical Engineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1080/15567265.2022.2070562","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
Evaluation of Thermal Hydraulic Characteristics of a Two Phase Superhydrophobic Microfluidic Device using Volume of Fluid Method
ABSTRACT The slug flow in a superhydrophobic microchannel with a T-junction was studied computationally. The continuous phase passed through the main channel while the dispersed phase 1 1. was introduced through the side channel. The volume of fluid (VOF) was employed to track the interface to study the dynamics of slug flow. First, a mesh independence study was carried out to select the optimum mesh by comparison of CFD results with experimental data. The developed model of microchannel was used to study slug flow heat transfer enhancement for micro cooling of electronic chips. The constant heat flux was applied on the walls of the microchannels and the axial wall temperature profile was noted. Upon quantification of heat transfer augmentation in terms of wall temperature reduction, Nusselt number and heat transfer coefficient enhancement, it was noted that slug flow performed much better vis-à-vis single-phase flows at similar conditions.
期刊介绍:
Nanoscale and Microscale Thermophysical Engineering is a journal covering the basic science and engineering of nanoscale and microscale energy and mass transport, conversion, and storage processes. In addition, the journal addresses the uses of these principles for device and system applications in the fields of energy, environment, information, medicine, and transportation.
The journal publishes both original research articles and reviews of historical accounts, latest progresses, and future directions in this rapidly advancing field. Papers deal with such topics as:
transport and interactions of electrons, phonons, photons, and spins in solids,
interfacial energy transport and phase change processes,
microscale and nanoscale fluid and mass transport and chemical reaction,
molecular-level energy transport, storage, conversion, reaction, and phase transition,
near field thermal radiation and plasmonic effects,
ultrafast and high spatial resolution measurements,
multi length and time scale modeling and computations,
processing of nanostructured materials, including composites,
micro and nanoscale manufacturing,
energy conversion and storage devices and systems,
thermal management devices and systems,
microfluidic and nanofluidic devices and systems,
molecular analysis devices and systems.