有机磷存在下水溶液电沉积镍铜合金

Hassan Hadi
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引用次数: 0

摘要

在恒流条件下,在有有机添加剂存在的水溶液中沉积镍铜(Ni-Cu)合金薄膜。利用循环伏安法、光谱学和x射线技术研究了电沉积过程和电催化行为。电沉积水溶液由镍、铜离子和一些有机添加剂组成。为了改善表面形貌,添加了有机添加剂。采用EDX、SEM、XRD等不同的x射线技术对涂层质量和表面形貌进行了测试。结果表明,在电沉积液中加入有机添加剂可降低沉积速率和断口密度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrodeposition of Nickel-copper alloy from aqueous solutions in the presence oforganicadditives
On copper substrates, nickel-copper (Ni-Cu) alloy films were deposited from aqueous solutions in the presence of organic additives under galvanostatic conditions.The electrodeposition process and the electrocatalytic behavior of coated thin film were investigated using cyclic voltammetry, spectroscopic and X-ray techniques.The elctrodeposition aqueous solution was composed of nickel and copper ions with some organic additives. Organic additives were added in order to enhance the surface morphology.The coating quality and surface morphology were tested using different X-ray techniques, such as EDX, SEM, and XRD. It was found that the addition of organic additives to the electrodeposition aqueous bathsreduces the deposition rate and fracture density.
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