聚焦离子束光刻对La2−xSrxCuO4单晶的影响

IF 1.9 Q3 PHYSICS, CONDENSED MATTER
R. Caruso, F. Camino, G. Gu, J. Tranquada, Myung‐Geun Han, Yimei Zhu, A. Bollinger, I. Božović
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引用次数: 1

摘要

聚焦离子束(FIB)铣削是一种无掩模光刻技术,可以在微米和亚微米尺度上精确塑造3D材料。最近在La2−xSrxCuO4 (LSCO)薄膜中发现的电子向列性引发了在大块LSCO晶体中寻找相同现象的研究。有了这个动机,我们系统地探索了大块LSCO晶体的FIB图图化成适合纵向和横向电阻率测量的微器件。我们发现有几个不利因素会影响结果,最终影响有效使用FIB铣削制造亚微米LSCO器件的可能性,特别是在欠掺杂状态下。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of Focused Ion Beam Lithography on La2−xSrxCuO4 Single Crystals
Focused ion beam (FIB) milling is a mask-free lithography technique that allows the precise shaping of 3D materials on the micron and sub-micron scale. The recent discovery of electronic nematicity in La2−xSrxCuO4 (LSCO) thin films triggered the search for the same phenomenon in bulk LSCO crystals. With this motivation, we have systematically explored FIB patterning of bulk LSCO crystals into micro-devices suitable for longitudinal and transverse resistivity measurements. We found that several detrimental factors can affect the result, ultimately compromising the possibility of effectively using FIB milling to fabricate sub-micrometer LSCO devices, especially in the underdoped regime.
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来源期刊
Condensed Matter
Condensed Matter PHYSICS, CONDENSED MATTER-
CiteScore
2.90
自引率
11.80%
发文量
58
审稿时长
10 weeks
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