SiO2保护层对LiNbO3结构SAW谐振器的影响及温度特性研究

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Liu Qiang, Wen-Lin Yang, Cheng Chi, Hongyuan Li, Xu Hong
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引用次数: 0

摘要

本文以LiNbO3为压电衬底,Pt为电极,SiO2为保护层,采用多物理场耦合有限元模型研究了保护层厚度对瑞利波传播特性的影响,建立了保护层厚度与频率-温度系数TCF和机电耦合系数K 2之间的关系。实验分析了器件的频率特性以及电极和衬底结构在高温下的微观变化。结果表明:当归一化厚度小于31.25%时,不发生声模移;随着保护层厚度的增加,L波、SH波和SV波方向的振动位移减小,可以适当增加保护层厚度,减小SH波对瑞利波的干扰;TCF|随保护层厚度的增加而减小。不同温度下保护层厚度的变化导致K 2的波动;保护层结构导致Q值略有下降。随着温度的升高,SAW谐振器谐振频率的波动增大。SiO2保护层可以有效保护LiNbO3材料,同时提高Pt电极的高温工作稳定性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of SiO2 protective layer on LiNbO3 structured SAW resonators and temperature characteristics study
In this paper, using LiNbO3 as the piezoelectric substrate, Pt as the electrode and SiO2 as the protective layer, a multi-physics field coupled finite element model was used to investigate the effect of the protective layer thickness on the Rayleigh wave propagation characteristics, and the relationship between the protective layer thickness and the frequency–temperature coefficient TCF and electromechanical coupling coefficient K 2 is established. The frequency characteristics of the device and the microscopic changes of the electrode and substrate structures under high temperature were analyzed experimentally. The results show that no acoustic mode shift occurs when the normalized thickness is less than 31.25%. As the thickness of the protective layer increases, the vibration displacement in the direction of L wave, SH wave and SV wave decreases, and the thickness of the protective layer can be increased appropriately to reduce the interference of SH wave to Rayleigh wave; |TCF| decreases with increasing thickness of the protective layer. Changes in the thickness of the protective layer at different temperatures lead to fluctuations in K 2; the protective layer structure leads to a slight decrease in Q value. As the temperature increases, the fluctuation of the resonant frequency of the SAW resonator increases. The SiO2 protective layer can effectively protect LiNbO3 materials while improving the high-temperature working stability of Pt electrodes.
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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