{"title":"纳米互连等离子体二聚体的加热效应","authors":"R. Raman, J. Grasso, B. Willis","doi":"10.1142/s0129156423500040","DOIUrl":null,"url":null,"abstract":"Plasmonic nanostructures with electrical connections have potential applications as new electro-optic devices due to their strong light–matter interactions. Plasmonic dimers with nanogaps between adjacent nanostructures are especially good at enhancing local electromagnetic (EM) fields at resonance for improved performance. In this study, we use optical extinction measurements and high-resolution electron microscopy imaging to investigate the thermal stability of electrically interconnected plasmonic dimers and their optical and morphological properties. Experimental measurements and finite difference time domain (FDTD) simulations are combined to characterize temperature effects on the plasmonic properties of large arrays of Au nanostructures on glass substrates. Experiments show continuous blue shifts of extinction peaks for heating up to 210°C. Microscopy measurements reveal these peak shifts are due to morphological changes that shrink nanorods and increase nanogap distances. Simulations of the nanostructures before and after heating find good agreement with experiments. Results show that plasmonic properties are maintained after thermal processing, but peak shifts need to be considered for device design.","PeriodicalId":35778,"journal":{"name":"International Journal of High Speed Electronics and Systems","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-07-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Heating Effects on Nanofabricated Plasmonic Dimers with Interconnects\",\"authors\":\"R. Raman, J. Grasso, B. Willis\",\"doi\":\"10.1142/s0129156423500040\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Plasmonic nanostructures with electrical connections have potential applications as new electro-optic devices due to their strong light–matter interactions. Plasmonic dimers with nanogaps between adjacent nanostructures are especially good at enhancing local electromagnetic (EM) fields at resonance for improved performance. In this study, we use optical extinction measurements and high-resolution electron microscopy imaging to investigate the thermal stability of electrically interconnected plasmonic dimers and their optical and morphological properties. Experimental measurements and finite difference time domain (FDTD) simulations are combined to characterize temperature effects on the plasmonic properties of large arrays of Au nanostructures on glass substrates. Experiments show continuous blue shifts of extinction peaks for heating up to 210°C. Microscopy measurements reveal these peak shifts are due to morphological changes that shrink nanorods and increase nanogap distances. Simulations of the nanostructures before and after heating find good agreement with experiments. Results show that plasmonic properties are maintained after thermal processing, but peak shifts need to be considered for device design.\",\"PeriodicalId\":35778,\"journal\":{\"name\":\"International Journal of High Speed Electronics and Systems\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-07-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of High Speed Electronics and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1142/s0129156423500040\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of High Speed Electronics and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1142/s0129156423500040","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
Heating Effects on Nanofabricated Plasmonic Dimers with Interconnects
Plasmonic nanostructures with electrical connections have potential applications as new electro-optic devices due to their strong light–matter interactions. Plasmonic dimers with nanogaps between adjacent nanostructures are especially good at enhancing local electromagnetic (EM) fields at resonance for improved performance. In this study, we use optical extinction measurements and high-resolution electron microscopy imaging to investigate the thermal stability of electrically interconnected plasmonic dimers and their optical and morphological properties. Experimental measurements and finite difference time domain (FDTD) simulations are combined to characterize temperature effects on the plasmonic properties of large arrays of Au nanostructures on glass substrates. Experiments show continuous blue shifts of extinction peaks for heating up to 210°C. Microscopy measurements reveal these peak shifts are due to morphological changes that shrink nanorods and increase nanogap distances. Simulations of the nanostructures before and after heating find good agreement with experiments. Results show that plasmonic properties are maintained after thermal processing, but peak shifts need to be considered for device design.
期刊介绍:
Launched in 1990, the International Journal of High Speed Electronics and Systems (IJHSES) has served graduate students and those in R&D, managerial and marketing positions by giving state-of-the-art data, and the latest research trends. Its main charter is to promote engineering education by advancing interdisciplinary science between electronics and systems and to explore high speed technology in photonics and electronics. IJHSES, a quarterly journal, continues to feature a broad coverage of topics relating to high speed or high performance devices, circuits and systems.