{"title":"微带天线阵中人工磁导体表面去耦结构的设计与实现","authors":"Khader Zelani Shaik, P. Siddaiah, K. Prasad","doi":"10.1108/CW-04-2021-0100","DOIUrl":null,"url":null,"abstract":"\nPurpose\nMillimeter wave spectrum represents new opportunities to add capacity and faster speeds for next-generation services as fifth generation (5G) applications. In its Spectrum Frontiers proceeding, the Federal Communications Commision decided to focus on spectrum bands where the most spectrums are potentially available. A low profile antenna array with new decoupling structure is proposed and expected to resonate at higher frequency bands, i.e. millimeter wave frequencies, which are suitable for 5G applications.\n\n\nDesign/methodology/approach\nThe presented antenna contains artificial magnetic conductor (AMC) surface as decoupling structure. The proposed antenna array with novel AMC surface is operating at 29.1GHz and proven to be decoupling structure and capable of enhancing the isolation by reducing mutual coupling as 8.7dB between the array elements. It is evident that, and overall gain is improved as 10.1% by incorporating 1x2 Array with AMC Method. Mutual coupling between the elements of 1 × 2 antenna array is decreased by 39.12%.\n\n\nFindings\nThe proposed structure is designed and simulated using HFSS software and the results are obtained in terms of return loss, gain, voltage standing wave ratio (VSWR) and mutual coupling. The S-Parameters of each stage of design is tabulated and compared with each other to prove the decoupling capability of AMC surface in antenna arrays.\n\n\nOriginality/value\nThe proposed structure is designed and simulated using HFSS software, and the results are obtained in terms of return loss, gain, VSWR and mutual coupling. The S-Parameters of each stage of design is tabulated and compared with each other to prove the decoupling capability of AMC surface in antenna arrays.\n","PeriodicalId":50693,"journal":{"name":"Circuit World","volume":" ","pages":""},"PeriodicalIF":0.8000,"publicationDate":"2021-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Design and implementation of artificial magnetic conductor surface as decoupling structure in microstrip antenna arrays\",\"authors\":\"Khader Zelani Shaik, P. Siddaiah, K. Prasad\",\"doi\":\"10.1108/CW-04-2021-0100\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\nPurpose\\nMillimeter wave spectrum represents new opportunities to add capacity and faster speeds for next-generation services as fifth generation (5G) applications. In its Spectrum Frontiers proceeding, the Federal Communications Commision decided to focus on spectrum bands where the most spectrums are potentially available. A low profile antenna array with new decoupling structure is proposed and expected to resonate at higher frequency bands, i.e. millimeter wave frequencies, which are suitable for 5G applications.\\n\\n\\nDesign/methodology/approach\\nThe presented antenna contains artificial magnetic conductor (AMC) surface as decoupling structure. The proposed antenna array with novel AMC surface is operating at 29.1GHz and proven to be decoupling structure and capable of enhancing the isolation by reducing mutual coupling as 8.7dB between the array elements. It is evident that, and overall gain is improved as 10.1% by incorporating 1x2 Array with AMC Method. Mutual coupling between the elements of 1 × 2 antenna array is decreased by 39.12%.\\n\\n\\nFindings\\nThe proposed structure is designed and simulated using HFSS software and the results are obtained in terms of return loss, gain, voltage standing wave ratio (VSWR) and mutual coupling. The S-Parameters of each stage of design is tabulated and compared with each other to prove the decoupling capability of AMC surface in antenna arrays.\\n\\n\\nOriginality/value\\nThe proposed structure is designed and simulated using HFSS software, and the results are obtained in terms of return loss, gain, VSWR and mutual coupling. The S-Parameters of each stage of design is tabulated and compared with each other to prove the decoupling capability of AMC surface in antenna arrays.\\n\",\"PeriodicalId\":50693,\"journal\":{\"name\":\"Circuit World\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":0.8000,\"publicationDate\":\"2021-08-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Circuit World\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1108/CW-04-2021-0100\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Circuit World","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/CW-04-2021-0100","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Design and implementation of artificial magnetic conductor surface as decoupling structure in microstrip antenna arrays
Purpose
Millimeter wave spectrum represents new opportunities to add capacity and faster speeds for next-generation services as fifth generation (5G) applications. In its Spectrum Frontiers proceeding, the Federal Communications Commision decided to focus on spectrum bands where the most spectrums are potentially available. A low profile antenna array with new decoupling structure is proposed and expected to resonate at higher frequency bands, i.e. millimeter wave frequencies, which are suitable for 5G applications.
Design/methodology/approach
The presented antenna contains artificial magnetic conductor (AMC) surface as decoupling structure. The proposed antenna array with novel AMC surface is operating at 29.1GHz and proven to be decoupling structure and capable of enhancing the isolation by reducing mutual coupling as 8.7dB between the array elements. It is evident that, and overall gain is improved as 10.1% by incorporating 1x2 Array with AMC Method. Mutual coupling between the elements of 1 × 2 antenna array is decreased by 39.12%.
Findings
The proposed structure is designed and simulated using HFSS software and the results are obtained in terms of return loss, gain, voltage standing wave ratio (VSWR) and mutual coupling. The S-Parameters of each stage of design is tabulated and compared with each other to prove the decoupling capability of AMC surface in antenna arrays.
Originality/value
The proposed structure is designed and simulated using HFSS software, and the results are obtained in terms of return loss, gain, VSWR and mutual coupling. The S-Parameters of each stage of design is tabulated and compared with each other to prove the decoupling capability of AMC surface in antenna arrays.
期刊介绍:
Circuit World is a platform for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes.
Circuit World covers a broad range of topics, including:
• Circuit theory, design methodology, analysis and simulation
• Digital, analog, microwave and optoelectronic integrated circuits
• Semiconductors, passives, connectors and sensors
• Electronic packaging of components, assemblies and products
• PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes)
• Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal)
• Internet of Things (IoT).