L. Stucchi-Zucchi, Marcos Vinicius Puydinger dos Santos, Fernando César Rufino, José Alexandre Diniz
{"title":"硅纳米线技术:简评、国产解决方案及未来趋势","authors":"L. Stucchi-Zucchi, Marcos Vinicius Puydinger dos Santos, Fernando César Rufino, José Alexandre Diniz","doi":"10.29292/jics.v17i2.614","DOIUrl":null,"url":null,"abstract":"The silicon nanowire (SiNW) is poised to become an industry standard on the upcoming technological nodes. It presents improved current drive and modulation, minimized footprint, stackability, and a host of different beneficial characteristics. The last few years of research have focused on solving the last remaining challenges of SiNW fabrication as they roll into commercial usage. Now, novel devices, as well as channel and device stacking for 3D VLSI applications is being studied. As well as how can the SiNW geometry can be harnessed for More Than Moore materials and applications. In this review, we present a sample of the range of devices, techniques and applications of SiNW structures, alongside novel developments in the research carried out at University of Campinas. Demonstrations of JLFETs fabricated using Ga+-FIB, e-beam lithography, silicon etching in NH4OH solution, FinFETs fabricated using Ga+ lithography and strained silicon structures are shown. Promising future developments in VLSI and More Than Moore applications such as vertically stacked nanowire geometries, graphene nanoribbon devices, and MagFETs are also presented.","PeriodicalId":39974,"journal":{"name":"Journal of Integrated Circuits and Systems","volume":" ","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2022-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Silicon Nanowire Technologies: brief review, home-made solutions and future trends\",\"authors\":\"L. Stucchi-Zucchi, Marcos Vinicius Puydinger dos Santos, Fernando César Rufino, José Alexandre Diniz\",\"doi\":\"10.29292/jics.v17i2.614\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The silicon nanowire (SiNW) is poised to become an industry standard on the upcoming technological nodes. It presents improved current drive and modulation, minimized footprint, stackability, and a host of different beneficial characteristics. The last few years of research have focused on solving the last remaining challenges of SiNW fabrication as they roll into commercial usage. Now, novel devices, as well as channel and device stacking for 3D VLSI applications is being studied. As well as how can the SiNW geometry can be harnessed for More Than Moore materials and applications. In this review, we present a sample of the range of devices, techniques and applications of SiNW structures, alongside novel developments in the research carried out at University of Campinas. Demonstrations of JLFETs fabricated using Ga+-FIB, e-beam lithography, silicon etching in NH4OH solution, FinFETs fabricated using Ga+ lithography and strained silicon structures are shown. Promising future developments in VLSI and More Than Moore applications such as vertically stacked nanowire geometries, graphene nanoribbon devices, and MagFETs are also presented.\",\"PeriodicalId\":39974,\"journal\":{\"name\":\"Journal of Integrated Circuits and Systems\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-09-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Integrated Circuits and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.29292/jics.v17i2.614\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Integrated Circuits and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.29292/jics.v17i2.614","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0
摘要
硅纳米线(SiNW)有望成为即将到来的技术节点的行业标准。它具有改进的电流驱动和调制,最小的占地面积,可堆叠性和许多不同的有益特性。过去几年的研究集中在解决SiNW制造的最后遗留挑战,因为它们进入商业用途。目前,3D VLSI应用的新型器件以及通道和器件堆叠正在研究中。以及如何将SiNW几何结构用于More Than Moore材料和应用。在这篇综述中,我们展示了SiNW结构的一系列设备、技术和应用的样本,以及在坎皮纳斯大学进行的研究中的新进展。展示了采用Ga+-FIB、电子束光刻、NH4OH溶液中硅蚀刻、Ga+光刻和应变硅结构制备的finfet。展望VLSI和More Than Moore应用的未来发展,如垂直堆叠纳米线几何形状,石墨烯纳米带器件和磁体效应管。
Silicon Nanowire Technologies: brief review, home-made solutions and future trends
The silicon nanowire (SiNW) is poised to become an industry standard on the upcoming technological nodes. It presents improved current drive and modulation, minimized footprint, stackability, and a host of different beneficial characteristics. The last few years of research have focused on solving the last remaining challenges of SiNW fabrication as they roll into commercial usage. Now, novel devices, as well as channel and device stacking for 3D VLSI applications is being studied. As well as how can the SiNW geometry can be harnessed for More Than Moore materials and applications. In this review, we present a sample of the range of devices, techniques and applications of SiNW structures, alongside novel developments in the research carried out at University of Campinas. Demonstrations of JLFETs fabricated using Ga+-FIB, e-beam lithography, silicon etching in NH4OH solution, FinFETs fabricated using Ga+ lithography and strained silicon structures are shown. Promising future developments in VLSI and More Than Moore applications such as vertically stacked nanowire geometries, graphene nanoribbon devices, and MagFETs are also presented.
期刊介绍:
This journal will present state-of-art papers on Integrated Circuits and Systems. It is an effort of both Brazilian Microelectronics Society - SBMicro and Brazilian Computer Society - SBC to create a new scientific journal covering Process and Materials, Device and Characterization, Design, Test and CAD of Integrated Circuits and Systems. The Journal of Integrated Circuits and Systems is published through Special Issues on subjects to be defined by the Editorial Board. Special issues will publish selected papers from both Brazilian Societies annual conferences, SBCCI - Symposium on Integrated Circuits and Systems and SBMicro - Symposium on Microelectronics Technology and Devices.