FPIC:一种新的用于光学PCB保证的语义数据集

IF 2.1 4区计算机科学 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE

ACM Journal on Emerging Technologies in Computing Systems Pub Date : 2022-02-17 DOI:10.1145/3588032

Nathan Jessurun, Olivia P. Dizon-Paradis, Jacob Harrison, Shajib Ghosh, M. Tehranipoor, D. Woodard, N. Asadizanjani

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引用次数: 5

摘要

外包PCB制造需要提高硬件保证能力。已经提出了几种基于AOI的保证技术，利用使用数码相机获取的PCB图像。我们回顾了最先进的AOI技术，并观察到ML解决方案的强劲、快速趋势。这些需要大量标记的地面实况数据，而这在公开可用的PCB数据空间中是缺乏的。我们提供FPIC数据集来满足这一需求。此外，我们还概述了数据集支持的新硬件安全方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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FPIC: A Novel Semantic Dataset for Optical PCB Assurance

Outsourced PCB fabrication necessitates increased hardware assurance capabilities. Several assurance techniques based on AOI have been proposed that leverage PCB images acquired using digital cameras. We review state-of-the-art AOI techniques and observe a strong, rapid trend toward ML solutions. These require significant amounts of labeled ground truth data, which is lacking in the publicly available PCB data space. We contribute the FPIC dataset to address this need. Additionally, we outline new hardware security methodologies enabled by our dataset.

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来源期刊

ACM Journal on Emerging Technologies in Computing Systems 工程技术-工程：电子与电气

CiteScore

4.80

自引率

4.50%

发文量

审稿时长

3 months

期刊介绍： The Journal of Emerging Technologies in Computing Systems invites submissions of original technical papers describing research and development in emerging technologies in computing systems. Major economic and technical challenges are expected to impede the continued scaling of semiconductor devices. This has resulted in the search for alternate mechanical, biological/biochemical, nanoscale electronic, asynchronous and quantum computing and sensor technologies. As the underlying nanotechnologies continue to evolve in the labs of chemists, physicists, and biologists, it has become imperative for computer scientists and engineers to translate the potential of the basic building blocks (analogous to the transistor) emerging from these labs into information systems. Their design will face multiple challenges ranging from the inherent (un)reliability due to the self-assembly nature of the fabrication processes for nanotechnologies, from the complexity due to the sheer volume of nanodevices that will have to be integrated for complex functionality, and from the need to integrate these new nanotechnologies with silicon devices in the same system. The journal provides comprehensive coverage of innovative work in the specification, design analysis, simulation, verification, testing, and evaluation of computing systems constructed out of emerging technologies and advanced semiconductors