用TEP改性环氧胶粘剂粘合复合材料接头的脱粘

IF 2.9 4区 材料科学 Q2 ENGINEERING, CHEMICAL
Hasan Caglar, I. Sridhar, Mohit K. Sharma, K. Chian
{"title":"用TEP改性环氧胶粘剂粘合复合材料接头的脱粘","authors":"Hasan Caglar, I. Sridhar, Mohit K. Sharma, K. Chian","doi":"10.1080/00218464.2022.2152333","DOIUrl":null,"url":null,"abstract":"ABSTRACT Prevention of mechanical and thermal damage to the composite parts is crucial during the debonding process of adhesive joints. This work highlights the impact of thermally expanded particles (TEPs) on bulk adhesive properties and the lap shear strength of adhesively bonded GFRP joints. FTIR studies revealed insignificant chemical changes occurring among the epoxy and its blend with TEPs. The addition of TEPs has slightly influenced the glass transition temperature (Tg) of adhesive. TMA showed that TEPs lose permanent expansion above maximum expansion temperature due to burst and/or diffuse of gas through the thin shell. DIC analysis of materials revealed that CTE mismatch grows with the addition of TEPs in x and y directions. Increases in TEP content up to 15 wt.% also raised the maximum dimension change in the epoxy adhesive. DMA and TGA studies indicated no major change in storage modulus and weight loss when GFRP was heated up to 170°C. The contact angle of GFRP decreased substantially after plasma surface treatment. Plasma surface treatment provided higher bond strength at room temperature than sandblasting surface treatment and prevented fiber-tearing. Despite the incorporation of TEPs, the enhanced debonding effectiveness at 145°C was marginal (less than 5%) for the epoxy adhesive used in the study. The incorporation of TEPs generated the residual stresses inside the adhesive as confirmed by measuring the residual strength of SLJ samples, especially 10 wt.% TEPs-epoxy joints exhibited more than 20% strength drop.","PeriodicalId":14778,"journal":{"name":"Journal of Adhesion","volume":null,"pages":null},"PeriodicalIF":2.9000,"publicationDate":"2022-12-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Debonding of bonded composite joints with TEP modified epoxy adhesives\",\"authors\":\"Hasan Caglar, I. Sridhar, Mohit K. Sharma, K. Chian\",\"doi\":\"10.1080/00218464.2022.2152333\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"ABSTRACT Prevention of mechanical and thermal damage to the composite parts is crucial during the debonding process of adhesive joints. This work highlights the impact of thermally expanded particles (TEPs) on bulk adhesive properties and the lap shear strength of adhesively bonded GFRP joints. FTIR studies revealed insignificant chemical changes occurring among the epoxy and its blend with TEPs. The addition of TEPs has slightly influenced the glass transition temperature (Tg) of adhesive. TMA showed that TEPs lose permanent expansion above maximum expansion temperature due to burst and/or diffuse of gas through the thin shell. DIC analysis of materials revealed that CTE mismatch grows with the addition of TEPs in x and y directions. Increases in TEP content up to 15 wt.% also raised the maximum dimension change in the epoxy adhesive. DMA and TGA studies indicated no major change in storage modulus and weight loss when GFRP was heated up to 170°C. The contact angle of GFRP decreased substantially after plasma surface treatment. Plasma surface treatment provided higher bond strength at room temperature than sandblasting surface treatment and prevented fiber-tearing. Despite the incorporation of TEPs, the enhanced debonding effectiveness at 145°C was marginal (less than 5%) for the epoxy adhesive used in the study. The incorporation of TEPs generated the residual stresses inside the adhesive as confirmed by measuring the residual strength of SLJ samples, especially 10 wt.% TEPs-epoxy joints exhibited more than 20% strength drop.\",\"PeriodicalId\":14778,\"journal\":{\"name\":\"Journal of Adhesion\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.9000,\"publicationDate\":\"2022-12-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Adhesion\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1080/00218464.2022.2152333\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, CHEMICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Adhesion","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1080/00218464.2022.2152333","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, CHEMICAL","Score":null,"Total":0}
引用次数: 2

摘要

在粘接接头脱粘过程中,防止复合材料零件的机械损伤和热损伤是至关重要的。这项工作强调了热膨胀颗粒(TEPs)对GFRP粘接接头的整体粘接性能和搭接剪切强度的影响。FTIR研究显示环氧树脂及其与TEPs的共混物之间发生了微不足道的化学变化。TEPs的加入对胶粘剂的玻璃化转变温度(Tg)有轻微影响。TMA表明,在最高膨胀温度以上,TEPs由于气体通过薄壳的破裂和/或扩散而失去永久膨胀。材料的DIC分析表明,CTE错配随着x和y方向上TEPs的加入而增加。TEP含量增加到15wt .%时,也增加了环氧胶粘剂的最大尺寸变化。DMA和TGA研究表明,当GFRP加热到170°C时,其储存模量和重量损失没有重大变化。等离子体表面处理后,GFRP的接触角明显减小。等离子体表面处理在室温下比喷砂表面处理具有更高的结合强度,并防止纤维撕裂。尽管加入了TEPs,但对于研究中使用的环氧粘合剂来说,145°C时增强的脱粘效果是边际的(小于5%)。通过对SLJ试样残余强度的测量,证实了TEPs的加入会在胶粘剂内部产生残余应力,特别是10 wt %的TEPs-环氧接头强度下降超过20%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Debonding of bonded composite joints with TEP modified epoxy adhesives
ABSTRACT Prevention of mechanical and thermal damage to the composite parts is crucial during the debonding process of adhesive joints. This work highlights the impact of thermally expanded particles (TEPs) on bulk adhesive properties and the lap shear strength of adhesively bonded GFRP joints. FTIR studies revealed insignificant chemical changes occurring among the epoxy and its blend with TEPs. The addition of TEPs has slightly influenced the glass transition temperature (Tg) of adhesive. TMA showed that TEPs lose permanent expansion above maximum expansion temperature due to burst and/or diffuse of gas through the thin shell. DIC analysis of materials revealed that CTE mismatch grows with the addition of TEPs in x and y directions. Increases in TEP content up to 15 wt.% also raised the maximum dimension change in the epoxy adhesive. DMA and TGA studies indicated no major change in storage modulus and weight loss when GFRP was heated up to 170°C. The contact angle of GFRP decreased substantially after plasma surface treatment. Plasma surface treatment provided higher bond strength at room temperature than sandblasting surface treatment and prevented fiber-tearing. Despite the incorporation of TEPs, the enhanced debonding effectiveness at 145°C was marginal (less than 5%) for the epoxy adhesive used in the study. The incorporation of TEPs generated the residual stresses inside the adhesive as confirmed by measuring the residual strength of SLJ samples, especially 10 wt.% TEPs-epoxy joints exhibited more than 20% strength drop.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Journal of Adhesion
Journal of Adhesion 工程技术-材料科学:综合
CiteScore
5.30
自引率
9.10%
发文量
55
审稿时长
1 months
期刊介绍: The Journal of Adhesion is dedicated to perpetuating understanding of the phenomenon of adhesion and its practical applications. The art of adhesion is maturing into a science that requires a broad, coordinated interdisciplinary effort to help illuminate its complex nature and numerous manifestations.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信