预测硅酸盐玻璃亚临界裂纹扩展、裂纹尖端松弛和静态疲劳阈值的动力学模型

Q1 Physics and Astronomy
S.J. Grutzik , K.T. Strong , J.M. Rimsza
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引用次数: 3

摘要

非晶态氧化玻璃的脆性断裂预测一直是一个挑战,因为存在多种断裂机制,随载荷条件的变化而变化。为了解决这一挑战,我们提出了玻璃中裂纹扩展的所有三种机制的模型。状态I和III受Arrhenius过程控制,而状态II受输运控制,并伴有一个简单的粘弹性应力松弛的Arrhenius模型。通过维度论证和物理推理,我们提出了一种单一的机制,它是III状态亚临界裂纹扩展和近裂纹尖端粘弹性松弛的基础。通过结合亚临界裂纹扩展和粘弹性模型,我们获得了阈值应力强度Kth的预测,低于该值,裂纹周围的应力松弛速度快于其扩展速度。对于应力强度KI<Kth,预计不会发生亚临界裂纹扩展,从而允许设计稳定的玻璃系统。将预测结果与实测的钠钙硅玻璃亚临界断裂阈值数据进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Kinetic model for prediction of subcritical crack growth, crack tip relaxation, and static fatigue threshold in silicate glass

Prediction of brittle fracture of amorphous oxide glasses continues to be a challenge due to the existence of multiple fracture mechanisms that vary with loading conditions. To address this challenge, we present a model for all three regimes of crack growth in glasses. Regimes I and III are controlled by Arrhenius processes while regime II is transport controlled along with a simple Arrhenius model for viscoelastic stress relaxation. Through dimensional arguments and physical reasoning, we propose a single mechanism which underlies both regime III subcritical crack growth and near-crack-tip viscoelastic relaxation. By combining the subcritical crack growth and viscoelastic models we obtain a prediction for a threshold stress intensity, Kth, below which stresses around the crack relax faster than it propagates. For stress intensity KI<Kth, no subcritical crack growth is predicted to occur, allowing for the design of stable glass systems. The prediction is compared to measured subcritical fracture threshold data for soda-lime silica glasses.

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来源期刊
Journal of Non-Crystalline Solids: X
Journal of Non-Crystalline Solids: X Materials Science-Materials Chemistry
CiteScore
3.20
自引率
0.00%
发文量
50
审稿时长
76 days
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