掺杂锌羟基磷灰石涂层在钛上的电泳沉积:沉积动力学和涂层形貌

IF 1 4区 工程技术 Q4 ENGINEERING, MECHANICAL
C. Moseke, Yunis Alnazal Alramadan, E. Vorndran, P. Elter
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引用次数: 3

摘要

采用湿化学方法,在钛上电泳沉积不同锌含量的羟基磷灰石(HA)涂层。通过x射线衍射、扫描电子显微镜和能量色散x射线分析对HA粉末和涂层进行了表征。锌的存在对结晶度的影响很小,对粉末和涂层的结晶形态几乎没有影响。高Zn的添加明显改变了涂层电解质中HA颗粒的迁移方向,也导致涂层干燥过程中裂纹的形成增加。锌通过离子取代和低晶ZnO相的掺入到HA涂层中,这可能有利于作为锌的长期储存库,作为生物材料的破骨抑制剂,用于危急骨情况下的植入。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrophoretic deposition of zinc-doped hydroxyapatite coatings on titanium: deposition kinetics and coating morphology
A wet chemistry reaction route was utilised to fabricate hydroxyapatite (HA) coatings with the incorporation of different amounts of zinc by electrophoretic deposition on titanium. HA powders and coatings were characterised by X-ray diffraction, scanning electron microscopy, and energy dispersive X-ray analysis. The presence of Zn had only a small impact on the crystallinity and practically no effect on the crystallite morphology of the powders and coatings. High additions of Zn apparently led to a change of the migration direction of the HA particles in the coating electrolyte and also resulted in increased crack formation during the drying process of the deposited coatings. Zn was incorporated in the HA coatings by ionic substitution and by incorporation of a low-crystalline ZnO phase, which may be advantageous for the application as a long-term reservoir for Zn as an osteoclast-inhibiting agent on biomaterials for implantation in critical bone situations.
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来源期刊
CiteScore
1.60
自引率
25.00%
发文量
21
审稿时长
>12 weeks
期刊介绍: IJSurfSE publishes refereed quality papers in the broad field of surface science and engineering including tribology, but with a special emphasis on the research and development in friction, wear, coatings and surface modification processes such as surface treatment, cladding, machining, polishing and grinding, across multiple scales from nanoscopic to macroscopic dimensions. High-integrity and high-performance surfaces of components have become a central research area in the professional community whose aim is to develop highly reliable ultra-precision devices.
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