改进自适应热误差补偿模型的智能数控控制

IF 0.7 Q4 ENGINEERING, MECHANICAL
Hui Shen, Liu Yang
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引用次数: 0

摘要

在车间生产中,计算机数控系统的热误差严重降低了生产效率。为此,提出了一种改进的自适应TE补偿模型(TECM),以提高数控加工的生产率和生产智能化。该模型基于在线测温系统(OTMS),提高了反向传播神经网络(BPNN)温度预测的自适应学习率。最后,利用温度变化与TEs的相关值进行热误差补偿。对模型的性能验证表明,提出的OTMS能够实现有效的温度采集和处理,改进的BPNN的预测能力明显高于其他预测算法。最后,在试验中发现,改进后的自适应TECM可将工件加工的轮廓误差减小到0.02×10-3 mm以内,CNC的加工精度显著提高。以上结果表明,采用改进的自适应TECM可以促进数控系统的智能化发展,提高其加工精度,对车间制造的发展具有重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Intelligent CNC control with improved adaptive thermal error compensation model
The thermal errors (TE) of computer numerical control (CNC) in workshop production seriously reduces the productivity. Therefore, to improve the productivity of CNC and enhance production intelligence, an improved adaptive TE compensation model (TECM) is proposed. The model is based on an online temperature measurement system (OTMS), which improves the adaptive learning rate of back-propagation neural network (BPNN) for temperature prediction. Finally, the correlation value between temperature changes and TEs is used for thermal error compensation. The performance verification of the model shows that the proposed OTMS can achieve effective temperature acquisition and processing, and the prediction ability of the improved BPNN is significantly higher than that of other prediction algorithms. Finally, it is found in the test that the improved adaptive TECM can reduce the contour error of workpiece machining to within 0.02×10-3 mm, the machining accuracy of CNC is significantly improved. The above results show that using the improved adaptive TECM can promote the intelligent development of CNC and improve their machining accuracy, which is of great significance to the development of workshop manufacturing.
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来源期刊
Journal of Vibroengineering
Journal of Vibroengineering 工程技术-工程:机械
CiteScore
1.70
自引率
0.00%
发文量
97
审稿时长
4.5 months
期刊介绍: Journal of VIBROENGINEERING (JVE) ISSN 1392-8716 is a prestigious peer reviewed International Journal specializing in theoretical and practical aspects of Vibration Engineering. It is indexed in ESCI and other major databases. Published every 1.5 months (8 times yearly), the journal attracts attention from the International Engineering Community.
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