Sn-0.7Cu-0.05Ni无铅焊料在3.5wt.%NaCl溶液中的腐蚀和浸出行为

IF 1.5 Q4 ELECTROCHEMISTRY

International Journal of Corrosion Pub Date : 2018-05-02 DOI:10.1155/2018/6580750

Jan-Ervin C. Guerrero, D. Camacho, O. Mokhtari, H. Nishikawa

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引用次数: 6

摘要

研究了新型三元Sn-0.7Cu-0.05Ni合金在3.5 wt中的腐蚀和浸出行为。本文报道了% NaCl溶液。动电位极化测量结果表明，Sn-0.7Cu-0.05Ni的腐蚀速率最高。30 d Sn浸出测量结果表明，15 d后Sn- cu - ni接头由于形成较薄的钝化膜而略有减少。锡的浸出量在焊点中比在焊料合金中要高，这是由于焊点表面发生了电蚀。腐蚀表面的EDS和XRD结果证实了腐蚀产物是锡的氧化物。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

The corrosion and leaching behaviour of a new ternary Sn-0.7Cu-0.05Ni alloy in 3.5 wt.% NaCl solution is reported herein. Potentiodynamic polarization measurements show that Sn-0.7Cu-0.05Ni has the highest corrosion rate. Results of the 30-day Sn leaching measurement show that Sn-Cu-Ni joint has slight decrease attributed to the formation of thin passivation film after 15 days. The leaching amounts of Sn are observed to be higher in solder joint than in solder alloy due to the galvanic corrosion happening on the surface. EDS and XRD results of the corroded surface confirm that the corroded product is made up of oxides of tin.

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来源期刊

International Journal of Corrosion ELECTROCHEMISTRY-

CiteScore

5.70

自引率

0.00%

发文量

审稿时长

14 weeks