从固体废物中生长石墨烯的摩擦学潜力

Q1 Economics, Econometrics and Finance

Progress in Industrial Ecology Pub Date : 2019-09-03 DOI:10.1504/pie.2019.10023640

N. A. M. Tahir, M. Abdollah, N. Tamaldin, H. Amiruddin, Mohd. Zin, T. Tokoroyama, N. Umehara

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引用次数: 2

摘要

本研究旨在通过化学气相沉积法确定固体废物在铜基底上生长石墨烯的摩擦学潜力。这项研究的重点是从水果覆盖塑料垃圾（FCPW）和油棕纤维（OPF）中生长石墨烯，并使用拉曼光谱检测了石墨烯的结构。然后，使用球盘式摩擦计进行摩擦学测试，并使用纳米压头在磨损和未磨损表面上进行硬度测试。结果表明，石墨烯是从这两种来源成功生长的。同时，摩擦学研究发现，与纯铜相比，这两种涂层都显示出更高的摩擦系数（μ）。然而，磨损率（k）与μ相矛盾，其中发现k比纯铜低60%至75%。最后，硬度分析表明，随着表面硬度的增加，涂层在100米的滑动中受损。

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The tribological potential of graphene growth from solid waste

This study aimed to identify the tribological potential of graphene growth from solid waste products on copper substrate via the chemical vapour deposition method. The study focused on graphene growth from fruit cover plastic waste (FCPW) and oil palm fibre (OPF), the graphene structure was examined using Raman spectroscopy. Then, the tribological testing was performed using a ball-on-disc tribometer, and the hardness was performed using a nano-indenter on both the worn and unworn surfaces. The results show that graphene was successfully grown from both sources. Meanwhile, the tribological study found that both coatings showed a higher coefficient of friction (μ) compared to pure copper. However, the wear rate (k) was contradicted by the μ where the k was found to be 60% to 75% lower than pure copper. Finally, the hardness analysis revealed that the coating was damaged at 100 m sliding as the surface hardness increased.

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来源期刊

Progress in Industrial Ecology Economics, Econometrics and Finance-Economics, Econometrics and Finance (all)

CiteScore

1.10

自引率

0.00%

发文量

期刊介绍： PIE contributes to international research and practice in industrial ecology for sustainable development. PIE aims to establish channels of communication between academics, practitioners, business stakeholders and the government with an interdisciplinary and international approach to the challenges of corporate social responsibility and inter-organisational environmental management.