Jue Wang, Chengkun Cai, Feng Cui, Min Yang, Yize Liang, Jian Wang
{"title":"三维光子芯片上的裁剪光:一个多用途OAM模式光互连平台","authors":"Jue Wang, Chengkun Cai, Feng Cui, Min Yang, Yize Liang, Jian Wang","doi":"10.1117/1.AP.5.3.036004","DOIUrl":null,"url":null,"abstract":"Abstract. Explosive growth in demand for data traffic has prompted exploration of the spatial dimension of light waves, which provides a degree of freedom to expand data transmission capacity. Various techniques based on bulky optical devices have been proposed to tailor light waves in the spatial dimension. However, their inherent large size, extra loss, and precise alignment requirements make these techniques relatively difficult to implement in a compact and flexible way. In contrast, three-dimensional (3D) photonic chips with compact size and low loss provide a promising miniaturized candidate for tailoring light in the spatial dimension. Significantly, they are attractive for chip-assisted short-distance spatial mode optical interconnects that are challenging to bulky optics. Here, we propose and fabricate femtosecond laser-inscribed 3D photonic chips to tailor orbital angular momentum (OAM) modes in the spatial dimension. Various functions on the platform of 3D photonic chips are experimentally demonstrated, including the generation, (de)multiplexing, and exchange of OAM modes. Moreover, chip-chip and chip–fiber–chip short-distance optical interconnects using OAM modes are demonstrated in the experiment with favorable performance. This work paves the way to flexibly tailor light waves on 3D photonic chips and offers a compact solution for versatile optical interconnects and other emerging applications with spatial modes.","PeriodicalId":33241,"journal":{"name":"Advanced Photonics","volume":"5 1","pages":"036004 - 036004"},"PeriodicalIF":20.6000,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Tailoring light on three-dimensional photonic chips: a platform for versatile OAM mode optical interconnects\",\"authors\":\"Jue Wang, Chengkun Cai, Feng Cui, Min Yang, Yize Liang, Jian Wang\",\"doi\":\"10.1117/1.AP.5.3.036004\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Abstract. Explosive growth in demand for data traffic has prompted exploration of the spatial dimension of light waves, which provides a degree of freedom to expand data transmission capacity. Various techniques based on bulky optical devices have been proposed to tailor light waves in the spatial dimension. However, their inherent large size, extra loss, and precise alignment requirements make these techniques relatively difficult to implement in a compact and flexible way. In contrast, three-dimensional (3D) photonic chips with compact size and low loss provide a promising miniaturized candidate for tailoring light in the spatial dimension. Significantly, they are attractive for chip-assisted short-distance spatial mode optical interconnects that are challenging to bulky optics. Here, we propose and fabricate femtosecond laser-inscribed 3D photonic chips to tailor orbital angular momentum (OAM) modes in the spatial dimension. Various functions on the platform of 3D photonic chips are experimentally demonstrated, including the generation, (de)multiplexing, and exchange of OAM modes. Moreover, chip-chip and chip–fiber–chip short-distance optical interconnects using OAM modes are demonstrated in the experiment with favorable performance. This work paves the way to flexibly tailor light waves on 3D photonic chips and offers a compact solution for versatile optical interconnects and other emerging applications with spatial modes.\",\"PeriodicalId\":33241,\"journal\":{\"name\":\"Advanced Photonics\",\"volume\":\"5 1\",\"pages\":\"036004 - 036004\"},\"PeriodicalIF\":20.6000,\"publicationDate\":\"2023-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Advanced Photonics\",\"FirstCategoryId\":\"101\",\"ListUrlMain\":\"https://doi.org/10.1117/1.AP.5.3.036004\",\"RegionNum\":1,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"OPTICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Photonics","FirstCategoryId":"101","ListUrlMain":"https://doi.org/10.1117/1.AP.5.3.036004","RegionNum":1,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"OPTICS","Score":null,"Total":0}
Tailoring light on three-dimensional photonic chips: a platform for versatile OAM mode optical interconnects
Abstract. Explosive growth in demand for data traffic has prompted exploration of the spatial dimension of light waves, which provides a degree of freedom to expand data transmission capacity. Various techniques based on bulky optical devices have been proposed to tailor light waves in the spatial dimension. However, their inherent large size, extra loss, and precise alignment requirements make these techniques relatively difficult to implement in a compact and flexible way. In contrast, three-dimensional (3D) photonic chips with compact size and low loss provide a promising miniaturized candidate for tailoring light in the spatial dimension. Significantly, they are attractive for chip-assisted short-distance spatial mode optical interconnects that are challenging to bulky optics. Here, we propose and fabricate femtosecond laser-inscribed 3D photonic chips to tailor orbital angular momentum (OAM) modes in the spatial dimension. Various functions on the platform of 3D photonic chips are experimentally demonstrated, including the generation, (de)multiplexing, and exchange of OAM modes. Moreover, chip-chip and chip–fiber–chip short-distance optical interconnects using OAM modes are demonstrated in the experiment with favorable performance. This work paves the way to flexibly tailor light waves on 3D photonic chips and offers a compact solution for versatile optical interconnects and other emerging applications with spatial modes.
期刊介绍:
Advanced Photonics is a highly selective, open-access, international journal that publishes innovative research in all areas of optics and photonics, including fundamental and applied research. The journal publishes top-quality original papers, letters, and review articles, reflecting significant advances and breakthroughs in theoretical and experimental research and novel applications with considerable potential.
The journal seeks high-quality, high-impact articles across the entire spectrum of optics, photonics, and related fields with specific emphasis on the following acceptance criteria:
-New concepts in terms of fundamental research with great impact and significance
-State-of-the-art technologies in terms of novel methods for important applications
-Reviews of recent major advances and discoveries and state-of-the-art benchmarking.
The journal also publishes news and commentaries highlighting scientific and technological discoveries, breakthroughs, and achievements in optics, photonics, and related fields.