基于MD模拟的石英玻璃高温力学性能及表面损伤研究

Q3 Engineering
Xiaoguang Guo, Chong-feng Chen, R. Kang, Zhuji Jin
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引用次数: 6

摘要

采用基于分子动力学的纳米压痕模拟方法,研究了石英玻璃在高温下的力学性能(硬度、弹性模量)和表面损伤。通过将石英晶体模型加热至3000[公式:见正文]K并退火至300[公式:参见正文]K两次,制备石英玻璃模型。根据纳米压痕模拟结果,石英玻璃的硬度在1500[公式:见正文]K时比在300[公式:见正文]K下降低了53.6%,弹性模量增加了10.9%。当温度从300[公式:见正文]K上升到1500[公式:见正文]K时,石英玻璃的临界研磨深度从纳米级增加到微米级。对地下损伤的研究表明,随着温度的升高,损伤层厚度略有减小。损伤层在较低温度下在压头下方向下延伸,在较高温度下沿压头延伸。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Study of mechanical properties and subsurface damage of quartz glass at high temperature based on MD simulation
The mechanical properties (hardness, elastic modulus) and subsurface damage of quartz glass at high temperature are studied by nanoindentation simulation based on molecular dynamics (MD). By heating the quartz crystal model to 3000[Formula: see text]K and annealing to 300[Formula: see text]K twice, the quartz glass model is prepared. According to the nanoindentation simulation results, the hardness of quartz glass decreases by 53.6% and the elastic modulus increases by 10.9% at 1500[Formula: see text]K compared to those at 300[Formula: see text]K. When the temperature rises from 300[Formula: see text]K to 1500[Formula: see text]K, the critical grinding depth of quartz glass increases from nanoscale to micron-scale. The investigation of subsurface damage shows that the damaged layer thickness decreases slightly with the increase of temperature. The damaged layer extends downward under the indenter at lower temperature and extends along the indenter at higher temperature.
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来源期刊
Journal of Micromechanics and Molecular Physics
Journal of Micromechanics and Molecular Physics Materials Science-Polymers and Plastics
CiteScore
3.30
自引率
0.00%
发文量
27
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