前角和机头半径对光学硅纳米加工进给速率和表面质量的影响:建模、预测和优化研究

Q3 Engineering
Lukman N. Abdulkadir, Khaled Abou El Hossein, M. Liman
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引用次数: 0

摘要

硅因其在1.2μm至6.0μm波长(λ)范围内的高透射能力而被广泛应用于红外(IR)光学中。然而,高质量的光学部件需要低于或等于8nm的表面粗糙度(Ra)。光学硅的超高精度单点金刚石车削填补了这一空白,这是由于金刚石工具的除屑能力增强、晶粒结构清晰、摩擦系数低。本研究旨在通过控制切削参数和刀具几何形状来降低光学硅Ra值。分别用标准运行5、6、8、9和10实现了小于8nm的推荐Ra值。此外,由于高进给速率导致的高表面粗糙度在高刀具负前角和鼻部半径下被显著降低。此外,在0°前角时,随着刀尖半径的增加,由高进给率导致的不良表面质量降低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of rake angle and nose radius on optical silicon nanomachining feed rate and surface quality: a modelling, prediction and optimisation study
Silicon is widely used in infrared (IR) optics due to its high transmissive ability at wavelength (λ) ranging from 1.2 μm to 6.0 μm. However, optical components of high quality require surface roughness (Ra) below or equal to 8 nm. Ultra-high precision single-point diamond turning of optical silicon has filled this gap due to enhanced chip removal, well-defined grain structure and low coefficient of friction of diamond tool. This study aimed at reducing optical silicon Ra value by manipulating both cutting parameters and tool geometry. The recommended Ra value of less than 8 nm was achieved with standard runs 5, 6, 8, 9, and 10 respectively. Also, high surface roughness due to high feed rate was noted to be greatly reduced at high tool negative rake angle and nose radius. Additionally, with increase in tool nose radius at 0° rake angle, poor surface quality resulting from high feed rate reduced.
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来源期刊
International Journal of Nanomanufacturing
International Journal of Nanomanufacturing Engineering-Industrial and Manufacturing Engineering
CiteScore
0.60
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