用现代扫描电镜扫描透射电镜(STEM)分析晶体缺陷

IF 3.56 Q1 Medicine
Cheng Sun, Erich Müller, Matthias Meffert, Dagmar Gerthsen
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引用次数: 22

摘要

位错和层错是影响材料性能的重要晶体缺陷。目前,透射电子显微镜(TEM)是研究单位错和层错性质最常用的技术。具体来说,位错的Burgers向量b或层错的位移向量R可以根据g·b?=?n (g·R?=?n)的判据。基于互易定理,扫描透射电子显微镜(STEM)也可以用于缺陷表征,但目前使用较少。在这项工作中,我们证明了g·b?=?n (g·R?=?n)通过扫描电子显微镜的STEM成像分析了GaN中的位错和层错。该仪器配备了一个STEM探测器,双倾斜TEM样品支架和一个电荷耦合器件相机,用于获取轴上衍射图案。后两个附件是强制性的,以控制试样的方向,这在扫描电子显微镜之前是不可能的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Analysis of crystal defects by scanning transmission electron microscopy (STEM) in a modern scanning electron microscope

Analysis of crystal defects by scanning transmission electron microscopy (STEM) in a modern scanning electron microscope

Dislocations and stacking faults are important crystal defects, because they strongly influence material properties. As of now, transmission electron microscopy (TEM) is the most frequently used technique to study the properties of single dislocations and stacking faults. Specifically, the Burgers vector b of dislocations or displacement vector R of stacking faults can be determined on the basis of the g·b?=?n (g·R?=?n) criterion by setting up different two-beam diffraction conditions with an imaging vector g. Based on the reciprocity theorem, scanning transmission electron microscopy (STEM) can also be applied for defect characterization, but has been less frequently used up to now. In this work, we demonstrate g·b?=?n (g·R?=?n) analyses of dislocations and stacking faults in GaN by STEM imaging in a scanning electron microscope. The instrument is equipped with a STEM detector, double-tilt TEM specimen holder, and a charge-coupled-device camera for the acquisition of on-axis diffraction patterns. The latter two accessories are mandatory to control the specimen orientation, which has not been possible before in a scanning electron microscope.

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来源期刊
Advanced Structural and Chemical Imaging
Advanced Structural and Chemical Imaging Medicine-Radiology, Nuclear Medicine and Imaging
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