Cheng Sun, Erich Müller, Matthias Meffert, Dagmar Gerthsen
{"title":"用现代扫描电镜扫描透射电镜(STEM)分析晶体缺陷","authors":"Cheng Sun, Erich Müller, Matthias Meffert, Dagmar Gerthsen","doi":"10.1186/s40679-019-0065-1","DOIUrl":null,"url":null,"abstract":"<p>Dislocations and stacking faults are important crystal defects, because they strongly influence material properties. As of now, transmission electron microscopy (TEM) is the most frequently used technique to study the properties of single dislocations and stacking faults. Specifically, the Burgers vector <b>b</b> of dislocations or displacement vector <b>R</b> of stacking faults can be determined on the basis of the <b>g</b>·<b>b</b>?=?<i>n</i> (<b>g</b>·<b>R</b>?=?<i>n</i>) criterion by setting up different two-beam diffraction conditions with an imaging vector <b>g</b>. Based on the reciprocity theorem, scanning transmission electron microscopy (STEM) can also be applied for defect characterization, but has been less frequently used up to now. In this work, we demonstrate <b>g</b>·<b>b</b>?=?<i>n</i> (<b>g</b>·<b>R</b>?=?<i>n</i>) analyses of dislocations and stacking faults in GaN by STEM imaging in a scanning electron microscope. The instrument is equipped with a STEM detector, double-tilt TEM specimen holder, and a charge-coupled-device camera for the acquisition of on-axis diffraction patterns. The latter two accessories are mandatory to control the specimen orientation, which has not been possible before in a scanning electron microscope.</p>","PeriodicalId":460,"journal":{"name":"Advanced Structural and Chemical Imaging","volume":"5 1","pages":""},"PeriodicalIF":3.5600,"publicationDate":"2019-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1186/s40679-019-0065-1","citationCount":"22","resultStr":"{\"title\":\"Analysis of crystal defects by scanning transmission electron microscopy (STEM) in a modern scanning electron microscope\",\"authors\":\"Cheng Sun, Erich Müller, Matthias Meffert, Dagmar Gerthsen\",\"doi\":\"10.1186/s40679-019-0065-1\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>Dislocations and stacking faults are important crystal defects, because they strongly influence material properties. As of now, transmission electron microscopy (TEM) is the most frequently used technique to study the properties of single dislocations and stacking faults. Specifically, the Burgers vector <b>b</b> of dislocations or displacement vector <b>R</b> of stacking faults can be determined on the basis of the <b>g</b>·<b>b</b>?=?<i>n</i> (<b>g</b>·<b>R</b>?=?<i>n</i>) criterion by setting up different two-beam diffraction conditions with an imaging vector <b>g</b>. Based on the reciprocity theorem, scanning transmission electron microscopy (STEM) can also be applied for defect characterization, but has been less frequently used up to now. In this work, we demonstrate <b>g</b>·<b>b</b>?=?<i>n</i> (<b>g</b>·<b>R</b>?=?<i>n</i>) analyses of dislocations and stacking faults in GaN by STEM imaging in a scanning electron microscope. The instrument is equipped with a STEM detector, double-tilt TEM specimen holder, and a charge-coupled-device camera for the acquisition of on-axis diffraction patterns. The latter two accessories are mandatory to control the specimen orientation, which has not been possible before in a scanning electron microscope.</p>\",\"PeriodicalId\":460,\"journal\":{\"name\":\"Advanced Structural and Chemical Imaging\",\"volume\":\"5 1\",\"pages\":\"\"},\"PeriodicalIF\":3.5600,\"publicationDate\":\"2019-03-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1186/s40679-019-0065-1\",\"citationCount\":\"22\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Advanced Structural and Chemical Imaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://link.springer.com/article/10.1186/s40679-019-0065-1\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"Medicine\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Structural and Chemical Imaging","FirstCategoryId":"1085","ListUrlMain":"https://link.springer.com/article/10.1186/s40679-019-0065-1","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"Medicine","Score":null,"Total":0}
Analysis of crystal defects by scanning transmission electron microscopy (STEM) in a modern scanning electron microscope
Dislocations and stacking faults are important crystal defects, because they strongly influence material properties. As of now, transmission electron microscopy (TEM) is the most frequently used technique to study the properties of single dislocations and stacking faults. Specifically, the Burgers vector b of dislocations or displacement vector R of stacking faults can be determined on the basis of the g·b?=?n (g·R?=?n) criterion by setting up different two-beam diffraction conditions with an imaging vector g. Based on the reciprocity theorem, scanning transmission electron microscopy (STEM) can also be applied for defect characterization, but has been less frequently used up to now. In this work, we demonstrate g·b?=?n (g·R?=?n) analyses of dislocations and stacking faults in GaN by STEM imaging in a scanning electron microscope. The instrument is equipped with a STEM detector, double-tilt TEM specimen holder, and a charge-coupled-device camera for the acquisition of on-axis diffraction patterns. The latter two accessories are mandatory to control the specimen orientation, which has not been possible before in a scanning electron microscope.