用导波分析粘接复合材料接头的分层/脱粘传播

IF 3 Q2 ENGINEERING, CIVIL
L. Šedková, V. Vlk, J. Šedek
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引用次数: 4

摘要

摘要本文研究了复合材料粘接接头中的兰姆波脱粘和分层评估。具有初始分层的粘性粘结宽CFRP面板受到疲劳载荷。构造了平板和粘结截面的群速度色散曲线的一段。利用基本非对称兰姆波模式(A0)来评估损伤传播。结合A0模式的群速度变化,分析了脱粘/分层的深度和粘结段内的损伤程度。结果表明,适当的传感器位置和适当的频率选择能够评估三层系统中的接口故障。基于时间延迟,可以区分特定粘合剂中的分层。金相分析证实了分层扩展的深度。将基于导波的测量与超声A扫描进行比较并进行验证。此外,RAPID算法用于可视化损伤程度,在29.4%的疲劳寿命中首次检测到损伤。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Delamination/disbond propagation analysis in adhesively bonded composite joints using guided waves
ABSTRACT This paper investigates debonding and delamination assessment by means of Lamb waves in adhesively bonded composite joints. Adhesively bonded wide CFRP panels with initial delamination were subjected to fatigue loading. A segment of a group velocity dispersion curve was constructed for the plain panel and the bonded section. The fundamental asymmetrical Lamb wave mode (A0) was utilized to evaluate damage propagation. The depth of debonding/delamination and the extent of the damage within the bonded section were analyzed in relation to the group velocity change of the A0 mode. The results indicate that a suitable sensor placement and a proper frequency selection enable the assessment of the interface failure in the three-layer system. Based on the time delays, it was possible to distinguish delamination in the specific adherent. Metallographic analysis confirmed the depth of delamination propagation. Guided wave-based measurements were compared to and verified with ultrasonic A-scans. Additionally, RAPID algorithm was utilized to visualize damage extent with the first damage detection in 29.4 % of the fatigue life.
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来源期刊
CiteScore
3.90
自引率
9.50%
发文量
24
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