MISHEMT的多导通通道对其直流参数的影响

Q4 Engineering
B. Canales, P. Agopian
{"title":"MISHEMT的多导通通道对其直流参数的影响","authors":"B. Canales, P. Agopian","doi":"10.29292/jics.v18i1.662","DOIUrl":null,"url":null,"abstract":"The Si3N4/ AlGaN/ AlN/ GaN Metal-Insulator-Semiconductor High Electron Mobility Transistor (MISHEMT) analog performance was ascertained considering the device’s multiple channels. MISHEMTs with different gate lengths, source/drain electrodes depths, source/drain distances to the gate electrode and AlGaN aluminum molar fractions were analyzed. The total drain current has 3 different components, where one of them is related to MOS conduction and the other two are related to HEMT conduction. Due to their different transport mechanism and distance to the gate electrode, each channel conduction exhibits different threshold voltages, causing unusual transfer and output characteristics, such as transconductance multiple slopes and a steady output resistance. As a result, the MISHEMTs presents an unexpected increase in intrinsic voltage gain (Av) for high gate bias (strong conduction). The HEMT conduction and the conduction through all the AlGaN volume are responsible for sustaining drain current levels so high that it affects the Early voltage more strongly than the degradation of output conductance, ensuring a high Av values.","PeriodicalId":39974,"journal":{"name":"Journal of Integrated Circuits and Systems","volume":" ","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2023-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"MISHEMT’s multiple conduction channels influence on its DC parameters\",\"authors\":\"B. Canales, P. Agopian\",\"doi\":\"10.29292/jics.v18i1.662\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The Si3N4/ AlGaN/ AlN/ GaN Metal-Insulator-Semiconductor High Electron Mobility Transistor (MISHEMT) analog performance was ascertained considering the device’s multiple channels. MISHEMTs with different gate lengths, source/drain electrodes depths, source/drain distances to the gate electrode and AlGaN aluminum molar fractions were analyzed. The total drain current has 3 different components, where one of them is related to MOS conduction and the other two are related to HEMT conduction. Due to their different transport mechanism and distance to the gate electrode, each channel conduction exhibits different threshold voltages, causing unusual transfer and output characteristics, such as transconductance multiple slopes and a steady output resistance. As a result, the MISHEMTs presents an unexpected increase in intrinsic voltage gain (Av) for high gate bias (strong conduction). The HEMT conduction and the conduction through all the AlGaN volume are responsible for sustaining drain current levels so high that it affects the Early voltage more strongly than the degradation of output conductance, ensuring a high Av values.\",\"PeriodicalId\":39974,\"journal\":{\"name\":\"Journal of Integrated Circuits and Systems\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-05-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Integrated Circuits and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.29292/jics.v18i1.662\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Integrated Circuits and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.29292/jics.v18i1.662","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 1

摘要

考虑器件的多通道,确定了Si3N4/ AlGaN/ AlN/ GaN金属-绝缘体-半导体高电子迁移率晶体管(MISHEMT)的模拟性能。对不同栅极长度、源极/漏极深度、源极/漏极距离和AlGaN铝摩尔分数的MISHEMTs进行了分析。总漏极电流有3个不同的分量,其中一个与MOS导通有关,另外两个与HEMT导通有关。由于它们不同的传输机制和到栅极的距离,每个通道传导表现出不同的阈值电压,导致不寻常的转移和输出特性,如跨导多重斜率和稳定的输出电阻。因此,mishemt在高栅极偏置(强传导)下呈现出意想不到的固有电压增益(Av)增加。HEMT导通和通过所有AlGaN体积的导通负责维持如此高的漏极电流水平,以至于它对早期电压的影响比输出电导的退化更强烈,从而确保了高Av值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
MISHEMT’s multiple conduction channels influence on its DC parameters
The Si3N4/ AlGaN/ AlN/ GaN Metal-Insulator-Semiconductor High Electron Mobility Transistor (MISHEMT) analog performance was ascertained considering the device’s multiple channels. MISHEMTs with different gate lengths, source/drain electrodes depths, source/drain distances to the gate electrode and AlGaN aluminum molar fractions were analyzed. The total drain current has 3 different components, where one of them is related to MOS conduction and the other two are related to HEMT conduction. Due to their different transport mechanism and distance to the gate electrode, each channel conduction exhibits different threshold voltages, causing unusual transfer and output characteristics, such as transconductance multiple slopes and a steady output resistance. As a result, the MISHEMTs presents an unexpected increase in intrinsic voltage gain (Av) for high gate bias (strong conduction). The HEMT conduction and the conduction through all the AlGaN volume are responsible for sustaining drain current levels so high that it affects the Early voltage more strongly than the degradation of output conductance, ensuring a high Av values.
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来源期刊
Journal of Integrated Circuits and Systems
Journal of Integrated Circuits and Systems Engineering-Electrical and Electronic Engineering
CiteScore
0.90
自引率
0.00%
发文量
39
期刊介绍: This journal will present state-of-art papers on Integrated Circuits and Systems. It is an effort of both Brazilian Microelectronics Society - SBMicro and Brazilian Computer Society - SBC to create a new scientific journal covering Process and Materials, Device and Characterization, Design, Test and CAD of Integrated Circuits and Systems. The Journal of Integrated Circuits and Systems is published through Special Issues on subjects to be defined by the Editorial Board. Special issues will publish selected papers from both Brazilian Societies annual conferences, SBCCI - Symposium on Integrated Circuits and Systems and SBMicro - Symposium on Microelectronics Technology and Devices.
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