铝离子注入4H-SiC缺陷的电子顺磁共振表征

IF 2.7
Xiuhong Wang , Zongwei Xu , Mathias Rommel , Bing Dong , Le Song , Clarence Augustine TH Tee , Fengzhou Fang
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引用次数: 2

摘要

碳化硅(SiC)中深层缺陷是控制碳化硅电子器件性能的关键。本文利用电子顺磁共振(EPR)光谱研究了高温退火后铝离子注入的4H-SiC在77 K和123 K温度下的深层缺陷。结果表明,铝离子注入4H-SiC的主要缺陷是带正电的碳空位(VC+),掺杂浓度越高,VC+的浓度越高。发现材料缺陷的类型与掺杂浓度无关,尽管在光激发和较低温度下检测到更多的VC+缺陷。这些结果将有助于p型4H-SiC的基础研究和功能器件的发展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electron paramagnetic resonance characterization of aluminum ion implantation-induced defects in 4H-SiC

Deep-level defects in silicon carbide (SiC) are critical to the control of the performance of SiC electron devices. In this paper, deep-level defects in aluminum ion-implanted 4H-SiC after high-temperature annealing were studied using electron paramagnetic resonance (EPR) spectroscopy at temperatures of 77 K and 123 K under different illumination conditions. Results showed that the main defect in aluminum ion-implanted 4H-SiC was the positively charged carbon vacancy (VC+), and the higher the doping concentration was, the higher was the concentration of VC+. It was found that the type of material defect was independent of the doping concentration, although more VC+ defects were detected during photoexcitation and at lower temperatures. These results should be helpful in the fundamental research of p-type 4H-SiC fabrication in accordance with functional device development.

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