离子液体塑化大米淀粉基薄膜的物理、机械和电学特性

IF 0.9 Q4 ENGINEERING, CHEMICAL
Joydev Roy, S. Bhattacharya, P. Sahu, A. Das
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引用次数: 0

摘要

摘要以离子液体为增塑剂,以直链淀粉含量适中的大米淀粉为原料,制备了一种可生物降解的薄膜。利用化学计学原理对所制备的薄膜的物理、机械和电学性能进行了测定和分析。薄膜的水蒸气透过率和伸长率随1-丁基-3-甲基咪唑鎓氯化物(BMIMCl)浓度的增加而增加。当BMIMCl的浓度为4%(w/w)时,最高熔融温度为133.4°C。用XRD和FTIR对其结晶度和改性程度进行了表征。薄膜的最高导电性为0.29 S/m,而观察到的最低电阻为3.42 Ωm。采用层次聚类分析(HCA)和主成分分析(PCA)对薄膜的参数进行了化学计量学分析。本研究证明了使用含有BMIMCl的大米淀粉作为增塑剂来设计具有所需加热特性的导电膜的可能性。图形摘要
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Physical, mechanical, and electrical properties of rice starch-based films plasticised by ionic liquid
ABSTRACT A biodegradable film was developed using an ionic liquid as a plasticiser, and rice starch having medium amylose content. The physical, mechanical and electrical properties of the developed films were determined and analysed employing the principles of chemometrics. The water vapour transmission and elongation of the films increased with 1-butyl-3-methylimidazolium chloride (BMIMCl) concentration. The highest melting temperature was 133.4°C when the concentration of BMIMCl was 4% (w/w). The crystallinity and extent of modification were characterised by XRD and FTIR. The highest conduction of film was 0.29 S/m while the lowest resistance observed was 3.42 Ωm. The chemometric analysis of parameters of the film was carried out in terms of hierarchical cluster analysis (HCA) and principal component analysis (PCA). This study demonstrated the possibility of using rice starch with BMIMCl as the plasticiser to design an electroconductive film having the desired heating characteristics. GRAPHICAL ABSTRACT
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来源期刊
Indian Chemical Engineer
Indian Chemical Engineer ENGINEERING, CHEMICAL-
CiteScore
3.00
自引率
6.70%
发文量
33
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