高压GaN功率晶体管PCB布局优化

IF 2.6 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Power Electronics Magazine Pub Date : 2023-06-01 DOI:10.1109/MPEL.2023.3275311

E. Persson

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引用次数: 0

摘要

自40多年前第一个开关电源出现以来，印刷电路板（PCB）布局一直是电力电子设计的一个组成部分。无论晶体管技术如何，都必须理解和管理PCB布局添加到电路中的寄生阻抗，以使电路正确、可靠地工作，并且不会造成过度的电磁干扰（EMI）。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Optimizing PCB Layout for HV GaN Power Transistors

Printed circuit board (PCB) layout has been an integral aspect of power electronic design since the first switching power supplies appeared more than 40 years ago. Regardless of the transistor technology, the parasitic impedances added to the circuit by the PCB layout must be understood and managed for the circuit to function correctly, reliably, and without causing undue electromagnetic interference (EMI).

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来源期刊

IEEE Power Electronics Magazine ENGINEERING, ELECTRICAL & ELECTRONIC-

CiteScore

2.80

自引率

4.30%

发文量