用于氢光生产的TiO2纳米粒子上Pt沉积方法（化学还原与光辅助沉积）的比较研究

IF 0.9 Q3 ENGINEERING, MULTIDISCIPLINARY

Journal of Engineering and Technological Sciences Pub Date : 2022-12-31 DOI:10.5614/j.eng.technol.sci.2022.54.6.12

R. Ratnawati, S. Slamet, V. Wongso, J. Gunlazuardi, M. Ibadurrohman

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引用次数: 1

摘要

在本文中，我们报道了在TiO2纳米颗粒（TNP）上掺入Pt以产生H2的方法（化学还原和光辅助沉积）的比较研究。利用TEM和XRD研究了光催化剂的相结构。使用TPDRO设备通过脉冲化学吸附技术测量Pt在TNP上的分散程度。TEM图像、EDX光谱、元素图谱和AAS提供的结果证实了Pt在TNP上的成功沉积。XRD图谱证实了锐钛矿和金红石的微晶结构，而UV-vis光谱显示带隙从3.2eV的典型值降低到约2.9eV。发现沉积在TNP上的Pt的量和Pt的分散与H2的产生之间存在相关性。化学还原方法提供了更高程度的Pt沉积，与光沉积相比，沉积的Pt量增加了2.75倍。在Pt负载量为1w%时，这一特征有助于提高H2产量（3283µmol）

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A Comparative Study of Pt Depositing Methods (Chemical Reduction vs Photo-Assisted Deposition) onto TiO2 Nanoparticle for Hydrogen Photo-Production

In this paper, we report a comparative study on the methods (chemical reduction and photo-assisted deposition) of incorporating Pt onto TiO2 nanoparticles (TNP) for H2 generation. The phase structure of photocatalysts was scrutinized utilizing TEM and XRD. The degree of dispersion of Pt on the TNP is measured by a pulse chemisorption technique, using TPDRO equipment. Results provided by TEM images, EDX spectra, elemental mapping, and AAS confirmed the successful deposition of Pt on TNP. XRD patterns confirm an anatase and rutile crystallite structure, while UV-vis spectra show the reduction of bandgap from a typical value of 3.2 eV to ca. 2.9 eV. It is found that there is a correlation between the amount of Pt deposited on TNP and Pt dispersion with the H2 generation. The chemical reduction method offered a higher degree of Pt deposition, resulting in a 2.75 times larger amount of deposited Pt as compared to that resulted from photodeposition. This feature is perceived to contribute higher H2 yield (3283 µmol) at 1 w% of Pt loading

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来源期刊

Journal of Engineering and Technological Sciences ENGINEERING, MULTIDISCIPLINARY-

CiteScore

2.30

自引率

11.10%

发文量

审稿时长

24 weeks

期刊介绍： Journal of Engineering and Technological Sciences welcomes full research articles in the area of Engineering Sciences from the following subject areas: Aerospace Engineering, Biotechnology, Chemical Engineering, Civil Engineering, Electrical Engineering, Engineering Physics, Environmental Engineering, Industrial Engineering, Information Engineering, Mechanical Engineering, Material Science and Engineering, Manufacturing Processes, Microelectronics, Mining Engineering, Petroleum Engineering, and other application of physical, biological, chemical and mathematical sciences in engineering. Authors are invited to submit articles that have not been published previously and are not under consideration elsewhere.