How to predict residual stresses of curing adhesives ab initio solely using extended rheometry

ABSTRACT Prediction of residual stresses in adhesively bonded joints is a major topic among practitioners, as they significantly contribute to failure. The experimental determination of relevant material properties, like shrinkage, modulus development, and relaxation behavior, is considered highly complex. Viscoelastic and numerical models are often simplified to suit specific applications. However, most of them do not consider all relevant parameters or limited portions of the curing process. This publication addresses the lack of experimental methods to determine cure-dependent properties of reactive adhesives to use them as input for FE modelling to predict cure-induced stresses. The authors focus on extended rotational rheometry (ExRheo), to determine shrinkage, shear modulus, and relaxation in dependency of curing time for three adhesives. The relationship between change of viscoelastic properties, shrinkage, and curing degree is determined through DSC and kinetic modelling. The experimental results are modelled to be implemented in a numerical analysis in order to predict cure-induced stresses in constrained rheological experiment in ExRheo. Numerical results show very good agreement with the experiments, which validate the methodology. For the first time, shrinkage induced residual stresses are modelled ab initio over the curing process, without any assumptions, solely based upon direct experimental data using a single device.