Marvin Joshi, Kexin Hu, G. Soto-Valle, Hani Al Jamal, M. Tentzeris
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Next Generation RF Modules for 5G, IoT, AR/VR and RFID Applications
The rapid development and deployment of 5G/mm-Wave technologies for communication, sensing and energy harvesting applications have been on the rise. Consequently, the need for low-cost, scalable, agile and compact RF modules has become more prominent than ever. This paper presents a review of recent efforts in utilizing additive manufacturing techniques such as inkjet printing to sustainably accelerate the massive deployment of 5G/mm-Wave. First, a novel flexible and massively scalable multiple-input, multiple-output (MIMO) tile-based phased array enabled by additively manufactured microstrip-to-microstrip transitions is presented. Next, a novel Rotman-Based harmonic mmID tag for Ultra-Long-Range localization is presented. Finally, low-power, low-cost mm-Wave backscattering modules for localization and orientation sensing are demonstrated.
期刊介绍:
Launched in 1990, the International Journal of High Speed Electronics and Systems (IJHSES) has served graduate students and those in R&D, managerial and marketing positions by giving state-of-the-art data, and the latest research trends. Its main charter is to promote engineering education by advancing interdisciplinary science between electronics and systems and to explore high speed technology in photonics and electronics. IJHSES, a quarterly journal, continues to feature a broad coverage of topics relating to high speed or high performance devices, circuits and systems.