三层远端荧光粉几何结构:改善白光发射二极管光学性能的极佳选择

Q2 Computer Science

International Journal of Electrical and Computer Engineering Pub Date : 2023-10-01 DOI:10.11591/ijece.v13i5.pp5118-5125

T. Bui, My Hanh Nguyen Thi, N. D. Quoc Anh, Nguyen Le Thai

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引用次数: 0

摘要

高性能白光发光二极管(wled)是近年来玻璃磷(PiG)器件研究的目标。本文介绍了一种高显色指数(CRI)的WLED结构，并通过添加Zn2SiO4:Mn2+， As5+和YAl3O4B12:Eu3+实现了色温的相关。该技术降低了玻璃荧光粉生产过程中的温度，并将厚度控制在0.5 ~ 0.7 mm之间，从而生产出高色质PiG，高显色指数在80以上的wled，并将色温范围扩展到3900 ~ 5300 K。稳定的产热与PiG的非凡CRI相结合，证明低温烧结具有制造高质量wled的潜力。改进后的wled可用于许多高要求的照明领域，如色彩检查，医疗分析和美学照明。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Triple-layer remote phosphor geometry: an excellent selection to improve the optical properties of white light-emitted diodes

High performance white-light-emitting diodes (WLEDs) have been the goal of recent research on phosphor-in-glass (PiG) devices. In this paper, we introduce a configuration of WLED that achieves high color rendering index (CRI), and correlated color temperature with the addition of Zn2SiO4:Mn2+, As5+ and YAl3O4B12:Eu3+. The technique is lower the temperature during the creation process of phosphor in glass and control the consistent thickness in between 0.5 to 0.7 mm to yield high color quality PiG, high CRI above 80 WLEDs, and extend the color temperature range to 3,900 to 5,300 K. The consistent heat generation combined with extraordinary CRI for PiG prove that low temperature sintering has the potential to create WLEDs with advanced quality. The improved WLEDs can be utilized in many high-demand lighting fields such as chromatic examination, medical analysis, and aesthetic lighting.

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来源期刊

International Journal of Electrical and Computer Engineering Computer Science-Computer Science (all)

CiteScore

4.10

自引率

0.00%

发文量

177

期刊介绍： International Journal of Electrical and Computer Engineering (IJECE) is the official publication of the Institute of Advanced Engineering and Science (IAES). The journal is open to submission from scholars and experts in the wide areas of electrical, electronics, instrumentation, control, telecommunication and computer engineering from the global world. The journal publishes original papers in the field of electrical, computer and informatics engineering which covers, but not limited to, the following scope: -Electronics: Electronic Materials, Microelectronic System, Design and Implementation of Application Specific Integrated Circuits (ASIC), VLSI Design, System-on-a-Chip (SoC) and Electronic Instrumentation Using CAD Tools, digital signal & data Processing, , Biomedical Transducers and instrumentation, Medical Imaging Equipment and Techniques, Biomedical Imaging and Image Processing, Biomechanics and Rehabilitation Engineering, Biomaterials and Drug Delivery Systems; -Electrical: Electrical Engineering Materials, Electric Power Generation, Transmission and Distribution, Power Electronics, Power Quality, Power Economic, FACTS, Renewable Energy, Electric Traction, Electromagnetic Compatibility, High Voltage Insulation Technologies, High Voltage Apparatuses, Lightning Detection and Protection, Power System Analysis, SCADA, Electrical Measurements; -Telecommunication: Modulation and Signal Processing for Telecommunication, Information Theory and Coding, Antenna and Wave Propagation, Wireless and Mobile Communications, Radio Communication, Communication Electronics and Microwave, Radar Imaging, Distributed Platform, Communication Network and Systems, Telematics Services and Security Network; -Control[...] -Computer and Informatics[...]