硅电阻率行为

IF 0.5 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
G. Cibira
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引用次数: 0

摘要

任何半导体硅层的本征电阻率在很大程度上取决于掺杂剂和杂质的浓度。结构性能、处理、涂层、精加工等都会影响晶圆中给定pn结的动态电阻行为。它对于大量使用的光电、光电子、微电子和其他固态电子学非常重要。在这项工作中,提出了一种有效的、普遍适用的方法来研究硅电阻参数。首先,研究了硅带隙模型。研究了电阻率对电阻和复阻抗部分的影响。动态迭代数值模拟和模拟结合稀疏矩阵实验测量导致这些电阻参数的外推行为。所有参数都在可接受的实际范围内进行研究,直至极值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Silicon Resistivity Behaviour
Intrinsic resistivity of any semiconductor silicon layer strongly depends on dopants and impurities concentrations. Structural properties, treating, coating, finishing etc. affect dynamic resistance behaviour of a given p-n junction in a wafer. It is important for massively used photovoltaics, optoelectronics, microelectronics, and other solid-state electronics. In this work, efficient, universally applicable methodology is presented to investigate silicon resistive parameters. First, the silicon band gap models are studied. Influence of electrical resistivity on resistances and complex impedance parts is investigated. Dynamic iterative numerical modelling and simulations combined with sparse-matrix experimental measurements lead to extrapolated behaviours of these resistive parameters. All parameters are investigated within acceptable practical interval up to extremals.
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来源期刊
Advances in Electrical and Electronic Engineering
Advances in Electrical and Electronic Engineering ENGINEERING, ELECTRICAL & ELECTRONIC-
CiteScore
1.30
自引率
33.30%
发文量
30
审稿时长
25 weeks
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