金饰镀金工艺参数优化

Q4 Engineering
Prawit Jirathorn, Nakorn Karncharin, Lalita Buaphuen, W. Leelakaweewong, Chanpen Anurattananon
{"title":"金饰镀金工艺参数优化","authors":"Prawit Jirathorn, Nakorn Karncharin, Lalita Buaphuen, W. Leelakaweewong, Chanpen Anurattananon","doi":"10.1504/IJQET.2018.10015968","DOIUrl":null,"url":null,"abstract":"The purpose of this research is to reduce the over-specification of thickness in electroplating process of gold jewellery using experimental design for analysing optimisation of parameter conditions affecting thickness of gold jewellery in electroplating process and finding optimisation for controlling specification and reducing average thickness. The factors were electroplating period, gold concentration, the electric current and the electroplating temperature. Each factor had two levels. There were four responses collected, that were average gold thickness (Y1), minimum value of gold thickness (Y2), standard deviation of gold thickness (Y3) and average of gold on stainless steel sheet (Y4). 0.05 significance level was used. The results showed that the appropriate parameters were 17 minutes of electroplating period, 0.4 gram per litre of gold concentration, 0.6 amperes per square decimetre of electric current and 60 degree Celsius of electroplating temperature. The experiment could reduce the electroplating period by 4.20 minutes, the average gold thickness jig by 0.13 micron, minimum of gold thickness by 0.19 micron, and average gold percentage by 3.91 percent. These results reduced specification from maximum value of thickness from 3.75 micron to 3.55 micron and mid-thickness average from 3.50 micron to 3.45 micron.","PeriodicalId":38209,"journal":{"name":"International Journal of Quality Engineering and Technology","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2018-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Parameter optimisations for gold electroplating of gold jewellery\",\"authors\":\"Prawit Jirathorn, Nakorn Karncharin, Lalita Buaphuen, W. Leelakaweewong, Chanpen Anurattananon\",\"doi\":\"10.1504/IJQET.2018.10015968\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The purpose of this research is to reduce the over-specification of thickness in electroplating process of gold jewellery using experimental design for analysing optimisation of parameter conditions affecting thickness of gold jewellery in electroplating process and finding optimisation for controlling specification and reducing average thickness. The factors were electroplating period, gold concentration, the electric current and the electroplating temperature. Each factor had two levels. There were four responses collected, that were average gold thickness (Y1), minimum value of gold thickness (Y2), standard deviation of gold thickness (Y3) and average of gold on stainless steel sheet (Y4). 0.05 significance level was used. The results showed that the appropriate parameters were 17 minutes of electroplating period, 0.4 gram per litre of gold concentration, 0.6 amperes per square decimetre of electric current and 60 degree Celsius of electroplating temperature. The experiment could reduce the electroplating period by 4.20 minutes, the average gold thickness jig by 0.13 micron, minimum of gold thickness by 0.19 micron, and average gold percentage by 3.91 percent. These results reduced specification from maximum value of thickness from 3.75 micron to 3.55 micron and mid-thickness average from 3.50 micron to 3.45 micron.\",\"PeriodicalId\":38209,\"journal\":{\"name\":\"International Journal of Quality Engineering and Technology\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-09-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Quality Engineering and Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1504/IJQET.2018.10015968\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Quality Engineering and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1504/IJQET.2018.10015968","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0

摘要

本研究的目的是通过实验设计,分析电镀过程中影响金饰厚度的参数条件的优化,找到控制规格和降低平均厚度的优化方法,以减少金饰电镀过程中厚度的过度规范。影响因素有电镀时间、金浓度、电流和电镀温度。每个因素有两个层次。收集到4个响应,分别是平均金厚度(Y1)、金厚度最小值(Y2)、金厚度标准差(Y3)和不锈钢板上金的平均值(Y4)。采用0.05显著性水平。结果表明,适宜的参数为:电镀周期为17分钟,金浓度为0.4克/升,电流为0.6安培/平方分米,电镀温度为60℃。实验结果表明,该工艺可使电镀周期缩短4.20 min,金模平均厚度缩短0.13 μ m,最小金厚度缩短0.19 μ m,平均含金率提高3.91%。这些结果将规格从最大厚度从3.75微米减少到3.55微米,中厚度平均从3.50微米减少到3.45微米。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Parameter optimisations for gold electroplating of gold jewellery
The purpose of this research is to reduce the over-specification of thickness in electroplating process of gold jewellery using experimental design for analysing optimisation of parameter conditions affecting thickness of gold jewellery in electroplating process and finding optimisation for controlling specification and reducing average thickness. The factors were electroplating period, gold concentration, the electric current and the electroplating temperature. Each factor had two levels. There were four responses collected, that were average gold thickness (Y1), minimum value of gold thickness (Y2), standard deviation of gold thickness (Y3) and average of gold on stainless steel sheet (Y4). 0.05 significance level was used. The results showed that the appropriate parameters were 17 minutes of electroplating period, 0.4 gram per litre of gold concentration, 0.6 amperes per square decimetre of electric current and 60 degree Celsius of electroplating temperature. The experiment could reduce the electroplating period by 4.20 minutes, the average gold thickness jig by 0.13 micron, minimum of gold thickness by 0.19 micron, and average gold percentage by 3.91 percent. These results reduced specification from maximum value of thickness from 3.75 micron to 3.55 micron and mid-thickness average from 3.50 micron to 3.45 micron.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
International Journal of Quality Engineering and Technology
International Journal of Quality Engineering and Technology Engineering-Safety, Risk, Reliability and Quality
CiteScore
0.40
自引率
0.00%
发文量
1
期刊介绍: IJQET fosters the exchange and dissemination of research publications aimed at the latest developments in all areas of quality engineering. The thrust of this international journal is to publish original full-length articles on experimental and theoretical basic research with scholarly rigour. IJQET particularly welcomes those emerging methodologies and techniques in concise and quantitative expressions of the theoretical and practical engineering and science disciplines.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信