印楝胶对热塑性玉米淀粉基包装膜吸水性、生物降解性和力学性能的影响

IF 0.9 Q4 ENGINEERING, CHEMICAL
M. Anubha, R. Saranya, C. Chandrasatheesh, J. Jayapriya
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引用次数: 0

摘要

玉米淀粉(CS)是一种价格低廉、用途广泛的材料,当与增塑剂甘油(CS-Gly)混合时,可以很容易地成型为热塑性淀粉(TPS)膜。然而,由于其脆性和高水溶性,其在包装领域的应用受到限制。为了增强CS-Gly薄膜在包装应用中的功能特性,将其与印楝胶以0.3%和0.9%(w/w)的浓度共混。分析了玉米淀粉共混膜(CS-Gly-NG)的拉伸强度、伸长率、吸水性和生物降解性能。与CS Gly相比,共混膜的拉伸强度提高了1.1倍(24.49 ± 0.72 MPa)。然而,一旦天然树胶含量提高到0.9%(w/w),薄膜的TS就降低到21.28 ± 1.75 MPa,而抗水溶性得到了更大程度的改善。此外,生物降解性测试表明,在类似于自然环境的环境中,共混膜(64-69wt%)比CS-Gly膜(17.3%)分解得更快。因此,这种共混膜(CS-Gly-NG)可以用作市售的不可生物降解的聚乙烯膜的替代品,并且将对环境产生积极影响。图形摘要
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of neem gum on water sorption, biodegradability and mechanical properties of thermoplastic corn starch-based packaging films
ABSTRACT Cornstarch (CS) is an inexpensive and widely available material that can be easily moulded into thermoplastic starch (TPS) films when mixed with the plasticising agent glycerol (CS- Gly). However, its applications in the packaging sector are limited due to its brittleness and high-water solubility. To enhance the functional characteristics of the CS- Gly films in packaging applications, it was blended with neem gum at the concentrations of 0.3 and 0.9% (w/w). The tensile strength, elongation percentage, water sorption and biodegradability efficacy of the blended cornstarch films (CS-Gly-NG) were analysed. The tensile strength of the blended film improved by 1.1-fold compared with CS-Gly (24.49 ± 0.72 MPa) when the natural gum additive was used at 0.30% (w/w). However, once the natural gum content was raised to 0.9% (w/w), the TS of the film decreased to 21.28 ± 1.75 MPa, whereas the resistance to water solubility improved to a greater extent. Moreover, the biodegradability test showed that the blended films (64-69 wt %) disintegrated more rapidly than the CS-Gly film (17.3%) in a setting akin to the natural environment. Therefore, this blended film (CS-Gly-NG) can be used as an alternative to the commercially available non-biodegradable polyethene films and will have a positive impact on the environment. GRAPHICAL ABSTRACT
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来源期刊
Indian Chemical Engineer
Indian Chemical Engineer ENGINEERING, CHEMICAL-
CiteScore
3.00
自引率
6.70%
发文量
33
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