Optimal design scheme based on the segmental transmission line methodology for high-frequency interconnection in 3D micro/nano integration

With the continuous growth of signal frequency and package density, discontinuity of the high-frequency interconnection in 3D micro/nano integration becomes unavoidable, which results in serious signal integrity problems. Traditional interconnection design schemes, such as termination and shielding/isolation, cannot meet the requirements under the unified constraints of specific cost, space occupancy, and performance. In this study, a transmission line design optimization scheme based on the segmental transmission line (STL) methodology is proposed. The genetic algorithm is used to select the optimal segment structure parameters of the transmission line to construct an STL with satisfying transmission performance or meet the specific signal amplitude adjustment requirements. This scheme can be adapted to various signal transmission scenarios to significantly improve the signal loss caused by reflection or other negative electromagnetic factors and meet the requirements for the modeling of discontinuous transmission lines. The simulation results show that this scheme is effective in the design scenario of performance improvement or equivalent modeling of discontinuous transmission lines and has significant advantages in circuit area reduction.