具有含硅段的形状记忆聚合物。

Journal of Materials Chemistry Pub Date : 2010-03-07 Epub Date: 2010-01-14 DOI:10.1039/b924032b
Cody Alan Schoener, Christopher Bell Weyand, Ranjini Murthy, Melissa Ann Grunlan
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引用次数: 0

摘要

热响应形状记忆聚合物是一种形状受热调节的刺激响应材料。它们已作为智能材料在各种生物医学、工业和航空航天应用中进行了研究。绝大多数形状记忆聚合物仅限于由有机聚合物制备的形状记忆聚合物。在本工作中,开发了由无机含硅聚合物链段(聚二甲基硅氧烷,PDMS)和有机聚ε-己内酯(PCL)链段组成的形状记忆聚合物。PDMS由于其T g较低,是一种高效的软段。具有定制PCL链段长度的二丙烯酸酯化PCL n-嵌段-PDMS37-嵌段-PCL n-大分子单体的光化学固化产生了具有优异机械性能、形状固定性和形状恢复性的网络。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Shape memory polymers with silicon-containing segments.

Shape memory polymers with silicon-containing segments.

Shape memory polymers with silicon-containing segments.

Thermoresponsive shape memory polymers are stimuli-responsive materials whose shape is modulated by heat. They have been investigated as smart materials in a variety of biomedical, industrial and aerospace applications. The vast majority of shape memory polymers have been limited to those prepared from organic polymers. In this present work, shape memory polymers comprised of inorganic silicon-containing polymer segments (polydimethylsiloxane, PDMS) and organic poly(ε-caprolactone) (PCL) segments were developed. Because of its low T g, PDMS served as a highly effective soft segment. The photochemical cure of diacrylated PCL n -block-PDMS37-block-PCL n macromers with tailored PCL segment lengths produced networks with excellent mechanical properties, shape fixity, and shape recovery.

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来源期刊
Journal of Materials Chemistry
Journal of Materials Chemistry 工程技术-材料科学:综合
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1.5 months
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