基于mems的可植入压力传感器的非密封微封装技术的长期评估。

P Wang, S J A Majerus, R Karam, B Hanzlicek, D L Lin, H Zhu, J M Anderson, M S Damaser, C A Zorman, W H Ko
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引用次数: 13

摘要

本文报道了一种用于可植入MEMS压力传感器的微封装技术的长期评估。在85°C、1% wt盐水溶液中进行加速寿命测试时,全聚合物微包装可存活160天。封装对传感器灵敏度和非线性的影响最小,偏差分别小于5%和0.3%。对16个基于MEMS的压力传感器进行了为期6个月的体内评估,结果表明该微封装具有良好的生物相容性,可以保护MEMS压力传感器。据我们所知,这些结果为使用全聚合物微包装方法包装的设备建立了新的寿命记录。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
LONG-TERM EVALUATION OF A NON-HERMETIC MICROPACKAGE TECHNOLOGY FOR MEMS-BASED, IMPLANTABLE PRESSURE SENSORS.

This paper reports long-term evaluation of a micropackage technology for an implantable MEMS pressure sensor. The all-polymer micropackage survived 160 days when subjected to accelerated lifetime testing at 85 °C in a 1% wt. saline solution. The package shows minimum effect on sensors' sensitivity and nonlinearity, which deviated by less than 5% and 0.3%, respectively. A 6-month in vivo evaluation of 16 MEMS-based pressure sensors demonstrated that the proposed micropackage has good biocompatibility and can protect the MEMS pressure sensor. To the best of our knowledge, these results establish new lifetime records for devices packaged using an all-polymer micropackaging approach.

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