Maurício Bottene Guarda, Paolo Tulio Di Nizo, Gabriel Flores Abuna, Anderson Catelan, Mário Alexandre Coelho Sinhoreti, Rafael Pino Vitti
{"title":"电流辅助胶粘剂应用对their粘结强度和质量的影响。","authors":"Maurício Bottene Guarda, Paolo Tulio Di Nizo, Gabriel Flores Abuna, Anderson Catelan, Mário Alexandre Coelho Sinhoreti, Rafael Pino Vitti","doi":"10.3290/j.jad.a44870","DOIUrl":null,"url":null,"abstract":"<p><strong>Purpose: </strong>To assess the effect of the application of different electric currents on dentin bonding and resin infiltration of self-etching and etch-and-rinse adhesives.</p><p><strong>Materials and methods: </strong>Two hundred four sound third molars were selected and divided in groups according to the adhesive (self-etch [CSE, Clearfil SE Bond, Kuraray Noritake], universal [SBU, Single Bond Universal, 3M Oral Care], and etch-and-rinse [SB2, Adper Single Bond 2 (SB2), 3M Oral Care]) and electrical current used (0, 5, 10, 15, 20, 25, 30, and 35 μA). Light curing was performed for 10 s with an LED-curing unit at 1000 mW/cm2. Composite blocks were constructed of nanofilled composite in increments of 2 mm, which were light cured for 20 s. Specimens were sectioned into sticks with a cross-sectional area of ~1 mm2 and stored in distilled water at 37°C for 24 h. Microtensile bond strength (μTBS) testing (n = 8) was performed using a universal testing machine at a crosshead speed of 0.5 mm/min until failure. The bonding quality (n = 2) of adhesives applied with or without 35-μA electric current was evaluated using confocal laser scanning microscopy. Bond strengths were analyzed with two-way ANOVA and Tukey's test (α = 0.05).</p><p><strong>Results: </strong>CSE presented the highest μTBS for all electrical currents tested. For CSE and SBU, electrical currents from 0-20 μA showed the lowest μTBS. Electrical currents from 0-10 and 20-25 μA yielded the lowest μTBS for SB2. CSE and SB2 applied under 35 μA showed a greater number of resin tags in dentin tubules. Fluorescein penetration into the hybrid layer was found for SBU applied without electric current.</p><p><strong>Conclusion: </strong>The application of adhesives using 35-μA electric current improved the bond strength and quality of the adhesive interface.</p>","PeriodicalId":55604,"journal":{"name":"Journal of Adhesive Dentistry","volume":"22 4","pages":"393-398"},"PeriodicalIF":2.5000,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.3290/j.jad.a44870","citationCount":"10","resultStr":"{\"title\":\"Effect of Electric Current-assisted Application of Adhesives on their Bond Strength and Quality.\",\"authors\":\"Maurício Bottene Guarda, Paolo Tulio Di Nizo, Gabriel Flores Abuna, Anderson Catelan, Mário Alexandre Coelho Sinhoreti, Rafael Pino Vitti\",\"doi\":\"10.3290/j.jad.a44870\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p><strong>Purpose: </strong>To assess the effect of the application of different electric currents on dentin bonding and resin infiltration of self-etching and etch-and-rinse adhesives.</p><p><strong>Materials and methods: </strong>Two hundred four sound third molars were selected and divided in groups according to the adhesive (self-etch [CSE, Clearfil SE Bond, Kuraray Noritake], universal [SBU, Single Bond Universal, 3M Oral Care], and etch-and-rinse [SB2, Adper Single Bond 2 (SB2), 3M Oral Care]) and electrical current used (0, 5, 10, 15, 20, 25, 30, and 35 μA). Light curing was performed for 10 s with an LED-curing unit at 1000 mW/cm2. Composite blocks were constructed of nanofilled composite in increments of 2 mm, which were light cured for 20 s. Specimens were sectioned into sticks with a cross-sectional area of ~1 mm2 and stored in distilled water at 37°C for 24 h. Microtensile bond strength (μTBS) testing (n = 8) was performed using a universal testing machine at a crosshead speed of 0.5 mm/min until failure. The bonding quality (n = 2) of adhesives applied with or without 35-μA electric current was evaluated using confocal laser scanning microscopy. Bond strengths were analyzed with two-way ANOVA and Tukey's test (α = 0.05).</p><p><strong>Results: </strong>CSE presented the highest μTBS for all electrical currents tested. For CSE and SBU, electrical currents from 0-20 μA showed the lowest μTBS. Electrical currents from 0-10 and 20-25 μA yielded the lowest μTBS for SB2. CSE and SB2 applied under 35 μA showed a greater number of resin tags in dentin tubules. Fluorescein penetration into the hybrid layer was found for SBU applied without electric current.</p><p><strong>Conclusion: </strong>The application of adhesives using 35-μA electric current improved the bond strength and quality of the adhesive interface.</p>\",\"PeriodicalId\":55604,\"journal\":{\"name\":\"Journal of Adhesive Dentistry\",\"volume\":\"22 4\",\"pages\":\"393-398\"},\"PeriodicalIF\":2.5000,\"publicationDate\":\"2020-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.3290/j.jad.a44870\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Adhesive Dentistry\",\"FirstCategoryId\":\"3\",\"ListUrlMain\":\"https://doi.org/10.3290/j.jad.a44870\",\"RegionNum\":3,\"RegionCategory\":\"医学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"DENTISTRY, ORAL SURGERY & MEDICINE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Adhesive Dentistry","FirstCategoryId":"3","ListUrlMain":"https://doi.org/10.3290/j.jad.a44870","RegionNum":3,"RegionCategory":"医学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"DENTISTRY, ORAL SURGERY & MEDICINE","Score":null,"Total":0}
Effect of Electric Current-assisted Application of Adhesives on their Bond Strength and Quality.
Purpose: To assess the effect of the application of different electric currents on dentin bonding and resin infiltration of self-etching and etch-and-rinse adhesives.
Materials and methods: Two hundred four sound third molars were selected and divided in groups according to the adhesive (self-etch [CSE, Clearfil SE Bond, Kuraray Noritake], universal [SBU, Single Bond Universal, 3M Oral Care], and etch-and-rinse [SB2, Adper Single Bond 2 (SB2), 3M Oral Care]) and electrical current used (0, 5, 10, 15, 20, 25, 30, and 35 μA). Light curing was performed for 10 s with an LED-curing unit at 1000 mW/cm2. Composite blocks were constructed of nanofilled composite in increments of 2 mm, which were light cured for 20 s. Specimens were sectioned into sticks with a cross-sectional area of ~1 mm2 and stored in distilled water at 37°C for 24 h. Microtensile bond strength (μTBS) testing (n = 8) was performed using a universal testing machine at a crosshead speed of 0.5 mm/min until failure. The bonding quality (n = 2) of adhesives applied with or without 35-μA electric current was evaluated using confocal laser scanning microscopy. Bond strengths were analyzed with two-way ANOVA and Tukey's test (α = 0.05).
Results: CSE presented the highest μTBS for all electrical currents tested. For CSE and SBU, electrical currents from 0-20 μA showed the lowest μTBS. Electrical currents from 0-10 and 20-25 μA yielded the lowest μTBS for SB2. CSE and SB2 applied under 35 μA showed a greater number of resin tags in dentin tubules. Fluorescein penetration into the hybrid layer was found for SBU applied without electric current.
Conclusion: The application of adhesives using 35-μA electric current improved the bond strength and quality of the adhesive interface.
期刊介绍：
New materials and applications for adhesion are profoundly changing the way dentistry is delivered. Bonding techniques, which have long been restricted to the tooth hard tissues, enamel, and dentin, have obvious applications in operative and preventive dentistry, as well as in esthetic and pediatric dentistry, prosthodontics, and orthodontics. The current development of adhesive techniques for soft tissues and slow-releasing agents will expand applications to include periodontics and oral surgery. Scientifically sound, peer-reviewed articles explore the latest innovations in these emerging fields.
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