抗冲击可拉伸电子元件的设计。

Journal of Applied Mechanics Pub Date : 2016-10-01 Epub Date: 2016-08-10 DOI:10.1115/1.4034226
J H Yuan, M Pharr, X Feng, John A Rogers, Yonggang Huang
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引用次数: 12

摘要

可拉伸电子产品提供柔软,生物相容的机械性能;这些相同的属性使它们容易受到与物理影响相关的设备故障的影响。本文研究了可拉伸电子元件的设计,这种设计可以抵抗由于粘弹性封装层的加入而导致的冲击失效。结果表明,抗冲击性能取决于包封层的厚度和粘弹性,以及冲击的持续时间。建立了包封层临界厚度的解析模型。研究表明,一种商业上可用的低模量有机硅材料具有粘性,使其成为可拉伸电子器件封装层的良好候选者。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Design of Stretchable Electronics Against Impact.

Design of Stretchable Electronics Against Impact.

Design of Stretchable Electronics Against Impact.

Design of Stretchable Electronics Against Impact.

Stretchable electronics offer soft, biocompatible mechanical properties; these same properties make them susceptible to device failure associated with physical impact. This paper studies designs for stretchable electronics that resist failure from impacts due to incorporation of a viscoelastic encapsulation layer. Results indicate that the impact resistance depends on the thickness and viscoelastic properties of the encapsulation layer, as well as the duration of impact. An analytic model for the critical thickness of the encapsulation layer is established. It is shown that a commercially available, low modulus silicone material offers viscous properties that make it a good candidate as the encapsulation layer for stretchable electronics.

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