An evaluation of the antibacterial properties and shear bond strength of copper nanoparticles as a nanofiller in orthodontic adhesive.

Objectives: To evaluate the antibacterial properties and effects of an orthodontic adhesive containing copper nanoparticles (NPs) on the material's shear bond strength.

Methods: Antimicrobial activity was analysed by a disk diffusion test against S. aureus, E. coli and S. mutans. The NPs were added to the orthodontic adhesive at 0.0100 wt%, 0.0075 wt%, and 0.0050 wt%. Sixty extracted bicuspids were divided into two groups and the enamel of all teeth was conditioned with phosphoric acid. A coat of moisture insensitive primer (MIP) was applied prior to the bonding of brackets with composite resin. Group I served as a control and the bonding procedure was performed according to the manufacturer's instructions. Group II comprised the test teeth, into which 0.0100 wt% copper NPs were included in the MIP. Samples were tested and statistically analysed (p ≤ 0.05). The adhesive remnant index (ARI) was also assessed microscopically. -

Results: The adhesive with copper NPs showed a bactericidal effect against the bacteria under study. A significantly higher bond strength was obtained with the orthodontic adhesive that included 0.0100 wt% of copper NPs (15.23 ± 6.8 MPa) in comparison with the control group (9.59 ± 4.3 MPa). The ARI scores indicated that the groups were significantly different and strengthened by the incorporation of NPs (p = 0.004).

Conclusion: The results of the present study suggested that an orthodontic adhesive, which included copper NPs, significantly increased material shear bond strength without adverse side effects on colour and appearance. The adhesive interface was strengthened by homogeneously dispersed copper NPs added as a nanofiller.