研究了Ni-Sn镀层钝化膜的半导体特性和锡偏析机理

IF 4.5 3区 化学 Q1 Chemical Engineering
Donatien Ngendabanyikwa , Zhengyi Xu , Guozhe Meng , Yanqiu Wang , Junyi Wang , Yawei Shao
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引用次数: 0

摘要

采用脉冲电沉积技术,成功地沉积了镍锡纳米晶涂层(平均晶粒尺寸为15.78 nm),该涂层由相对有序的圆形颗粒覆盖整个表面,其末端呈结节状。利用扫描电子显微镜、能量色散x射线能谱仪(SEM-EDS)和x射线衍射仪(XRD)对膜的微观结构进行了分析。研究了镍锡镀层在硼酸盐缓冲溶液中的耐蚀性和半导体性能。EIS测试结果表明,Ni-Sn合金在钝化区具有良好的耐蚀性,表现为薄膜厚度薄、电容值低、极化电阻高、电场强度高。Mott-Schottky分析表明,Ni-Sn镀层上形成的钝化膜呈现p-n异质结特征,表明载流子密度由阳离子(NA)和阴离子(ND)空位组成。高密度的点缺陷(NA + ND ~ 1021cm−3)使Ni-Sn镀层具有较高的电子导电性。XPS分析表明,Ni-Sn合金表面形成的钝化膜主要由NiO、Ni(OH)2、NiOOH、SnO和SnO2组成,且钝化膜中Sn元素富集。结合点缺陷模型(PDM)提出了Ni-Sn钝化膜生长和锡偏析的机理。镍锡镀层具有良好的耐腐蚀性和高的电子导电性,是一种很好的水电解材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The semiconductor properties and tin segregation mechanism in the passive film formed on the electrodeposited Ni-Sn coatings

The nanocrystalline Ni-Sn coatings (average grain size 15.78 nm) formed of relatively ordered circular particles covering the entire surface characterized with nodule-like endings were successfully electrodeposited using pulse electrodeposition technique. Scanning electron microscopy coupled with energy-dispersive X-ray spectroscopy (SEM-EDS) and X-ray diffraction (XRD) were used to analyse the film microstructure. The corrosion resistance and semiconducting properties of Ni-Sn coatings were investigated in borate buffer solution. The EIS measurements showed that Ni-Sn alloys developed, in the passive zone, a good corrosion resistance as demonstrated by a thin film thickness, the low capacitance value, high polarization resistance, and the high value of electric field strength. Mott-Schottky analysis showed that the passive film formed on Ni-Sn coatings presents an p-n heterojunction characteristic indicating that the charge carrier densities are composed of cation (NA) and anion (ND) vacancies. The high density of point defects (NA + ND ∼ 1021cm−3) induces a high electronic conductivity in the Ni-Sn coatings passive film. The XPS analysis showed that the passive film formed on Ni-Sn alloys is composed of NiO, Ni(OH)2, NiOOH, SnO, and SnO2 species and an enrichment of Sn in the passive film. The mechanisms of passive film growth and Sn segregation in the Ni-Sn passive film are suggested in conjunction with the Point Defect Model (PDM). The good corrosion resistance and high electronic conductivity achieved in this work suggest that Ni-Sn Coating is a good candidate for water electrolysis applications.

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来源期刊
Journal of Electroanalytical Chemistry
Journal of Electroanalytical Chemistry Chemical Engineering-General Chemical Engineering
CiteScore
7.50
自引率
6.70%
发文量
912
审稿时长
>12 weeks
期刊介绍: The Journal of Electroanalytical Chemistry is the foremost international journal devoted to the interdisciplinary subject of electrochemistry in all its aspects, theoretical as well as applied. Electrochemistry is a wide ranging area that is in a state of continuous evolution. Rather than compiling a long list of topics covered by the Journal, the editors would like to draw particular attention to the key issues of novelty, topicality and quality. Papers should present new and interesting electrochemical science in a way that is accessible to the reader. The presentation and discussion should be at a level that is consistent with the international status of the Journal. Reports describing the application of well-established techniques to problems that are essentially technical will not be accepted. Similarly, papers that report observations but fail to provide adequate interpretation will be rejected by the Editors. Papers dealing with technical electrochemistry should be submitted to other specialist journals unless the authors can show that their work provides substantially new insights into electrochemical processes.
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