Yong Li , Kai Huang , Wenhui Liu , Kang Wang , Shuai Fu , Huazhang Guo , Jiye Zhang , Cheng Lian , Liang Wang
{"title":"碳量子点/金属有机骨架异质结构在二氧化碳和硝酸盐催化尿素电合成中的界面工程研究。","authors":"Yong Li , Kai Huang , Wenhui Liu , Kang Wang , Shuai Fu , Huazhang Guo , Jiye Zhang , Cheng Lian , Liang Wang","doi":"10.1016/j.jcis.2025.139264","DOIUrl":null,"url":null,"abstract":"<div><div>Electrocatalytic urea synthesis from CO<sub>2</sub> and NO<sub>3</sub><sup>−</sup> offers a sustainable alternative to conventional energy-intensive industrial processes. However, it remains hindered by sluggish C<img>N coupling kinetics and mismatched CO<sub>2</sub>/NO<sub>3</sub><sup>−</sup> reduction rates. Herein, a carbon quantum dots (CQDs)/metal-organic framework (MOF) heterostructure (Cu-MOF-CQD) was constructed by integrating amino-rich CQDs into the porous Cu-BTC framework (BTC = 1,3,5-benzenetricarboxylic acid) via a one-step ultrasonic-static strategy. The integration of CQDs markedly enhances the electrical conductivity of Cu-MOF and modulates the interfacial electronic structure through interactions between CQDs surface groups and unsaturated Cu sites within Cu-MOF, thereby enriching high-valence Cu species and facilitating charge transfer. Operando spectroscopic characterizations combined with density functional theory calculations unveil that the interface effect of Cu-MOF-CQD provides a stronger driving force for *COOH to *CO conversion and accelerates the coupling of *CO and *NH<sub>2</sub> intermediates, thus promoting efficient C<img>N bond formation. Benefiting from this synergistic interface, in a flow cell, Cu-MOF-CQD achieves a maximum urea Faradaic efficiency of 18.5 ± 0.7 % at −0.5 V vs. RHE and the corresponding urea yield rate of 260.2 ± 10.1 μg h<sup>−1</sup> mg<sub>cat</sub><sup>−1</sup>, surpassing the performance of pristine Cu-MOF. This work establishes a generalizable strategy of zero-dimensional carbon/MOF heterostructures for boosting C<img>N coupling performance, offering new design principles for next-generation electrocatalysts in sustainable C<img>N coupling reactions.</div></div>","PeriodicalId":351,"journal":{"name":"Journal of Colloid and Interface Science","volume":"703 ","pages":"Article 139264"},"PeriodicalIF":9.7000,"publicationDate":"2025-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Interfacial engineering of carbon quantum dot/metal-organic framework heterostructures for boosted urea electrosynthesis from carbon dioxide and nitrate\",\"authors\":\"Yong Li , Kai Huang , Wenhui Liu , Kang Wang , Shuai Fu , Huazhang Guo , Jiye Zhang , Cheng Lian , Liang Wang\",\"doi\":\"10.1016/j.jcis.2025.139264\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Electrocatalytic urea synthesis from CO<sub>2</sub> and NO<sub>3</sub><sup>−</sup> offers a sustainable alternative to conventional energy-intensive industrial processes. However, it remains hindered by sluggish C<img>N coupling kinetics and mismatched CO<sub>2</sub>/NO<sub>3</sub><sup>−</sup> reduction rates. Herein, a carbon quantum dots (CQDs)/metal-organic framework (MOF) heterostructure (Cu-MOF-CQD) was constructed by integrating amino-rich CQDs into the porous Cu-BTC framework (BTC = 1,3,5-benzenetricarboxylic acid) via a one-step ultrasonic-static strategy. The integration of CQDs markedly enhances the electrical conductivity of Cu-MOF and modulates the interfacial electronic structure through interactions between CQDs surface groups and unsaturated Cu sites within Cu-MOF, thereby enriching high-valence Cu species and facilitating charge transfer. Operando spectroscopic characterizations combined with density functional theory calculations unveil that the interface effect of Cu-MOF-CQD provides a stronger driving force for *COOH to *CO conversion and accelerates the coupling of *CO and *NH<sub>2</sub> intermediates, thus promoting efficient C<img>N bond formation. Benefiting from this synergistic interface, in a flow cell, Cu-MOF-CQD achieves a maximum urea Faradaic efficiency of 18.5 ± 0.7 % at −0.5 V vs. RHE and the corresponding urea yield rate of 260.2 ± 10.1 μg h<sup>−1</sup> mg<sub>cat</sub><sup>−1</sup>, surpassing the performance of pristine Cu-MOF. This work establishes a generalizable strategy of zero-dimensional carbon/MOF heterostructures for boosting C<img>N coupling performance, offering new design principles for next-generation electrocatalysts in sustainable C<img>N coupling reactions.</div></div>\",\"PeriodicalId\":351,\"journal\":{\"name\":\"Journal of Colloid and Interface Science\",\"volume\":\"703 \",\"pages\":\"Article 139264\"},\"PeriodicalIF\":9.7000,\"publicationDate\":\"2025-10-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Colloid and Interface Science\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0021979725026566\",\"RegionNum\":1,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"CHEMISTRY, PHYSICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Colloid and Interface Science","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0021979725026566","RegionNum":1,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
Interfacial engineering of carbon quantum dot/metal-organic framework heterostructures for boosted urea electrosynthesis from carbon dioxide and nitrate
Electrocatalytic urea synthesis from CO2 and NO3− offers a sustainable alternative to conventional energy-intensive industrial processes. However, it remains hindered by sluggish CN coupling kinetics and mismatched CO2/NO3− reduction rates. Herein, a carbon quantum dots (CQDs)/metal-organic framework (MOF) heterostructure (Cu-MOF-CQD) was constructed by integrating amino-rich CQDs into the porous Cu-BTC framework (BTC = 1,3,5-benzenetricarboxylic acid) via a one-step ultrasonic-static strategy. The integration of CQDs markedly enhances the electrical conductivity of Cu-MOF and modulates the interfacial electronic structure through interactions between CQDs surface groups and unsaturated Cu sites within Cu-MOF, thereby enriching high-valence Cu species and facilitating charge transfer. Operando spectroscopic characterizations combined with density functional theory calculations unveil that the interface effect of Cu-MOF-CQD provides a stronger driving force for *COOH to *CO conversion and accelerates the coupling of *CO and *NH2 intermediates, thus promoting efficient CN bond formation. Benefiting from this synergistic interface, in a flow cell, Cu-MOF-CQD achieves a maximum urea Faradaic efficiency of 18.5 ± 0.7 % at −0.5 V vs. RHE and the corresponding urea yield rate of 260.2 ± 10.1 μg h−1 mgcat−1, surpassing the performance of pristine Cu-MOF. This work establishes a generalizable strategy of zero-dimensional carbon/MOF heterostructures for boosting CN coupling performance, offering new design principles for next-generation electrocatalysts in sustainable CN coupling reactions.
期刊介绍:
The Journal of Colloid and Interface Science publishes original research findings on the fundamental principles of colloid and interface science, as well as innovative applications in various fields. The criteria for publication include impact, quality, novelty, and originality.
Emphasis:
The journal emphasizes fundamental scientific innovation within the following categories:
A.Colloidal Materials and Nanomaterials
B.Soft Colloidal and Self-Assembly Systems
C.Adsorption, Catalysis, and Electrochemistry
D.Interfacial Processes, Capillarity, and Wetting
E.Biomaterials and Nanomedicine
F.Energy Conversion and Storage, and Environmental Technologies